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CL10C102JB81PNC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10C102JB81PNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10C102JB81PNC
- Electronic Component
- 1
- Electronic Component
- 1nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0257686747
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL10C102JB81PNC 产品概述
一、产品概述
CL10C102JB81PNC 为 SAMSUNG（三星）贴片多层陶瓷电容（MLCC），规格为 0603 封装，标称电容 1 nF，精度 ±5%，额定电压 50 V，温度系数 C0G（又称 NP0）。本产品以尺寸小、温度特性优良、介质损耗低和可靠性高为特点，适用于要求稳定电容值与低损耗的精密电路和高频场合。
二、关键参数
- 容值：1 nF（102）
- 精度：±5%（J）
- 额定电压：50 V
- 温度系数：C0G（近零温度漂移，典型 ±30 ppm/°C）
- 封装：0603（英制 0201mm 等效）
- 类型：多层陶瓷贴片电容（MLCC）
三、主要特性
- 温度稳定性好：C0G 类介质在宽温区间内电容变化极小，适合精密滤波与定时电路。
- 损耗低、直流偏置影响小：适用于高频驱动、射频电路及要求高 Q 值的场合。
- 小体积、高可靠性：0603 封装便于实现高密度贴装与自动化生产。
- 良好的焊接适应性：适配常见回流焊工艺，但需注意热历程和基板机械应力。
四、典型应用
- 高频滤波、旁路与去耦（特别是在高频段表现优异）
- 精密定时与谐振电路（振荡器、滤波器）
- ADC/DAC 前端去耦与模拟信号处理
- 无线通信模块和射频电路中的匹配网络
- 工业、消费电子与汽车电子（需按汽车级要求另行确认）
五、封装与工艺注意事项
- 回流焊：遵循厂家或 JEDEC 建议回流曲线，峰值温度通常不超过 260°C。
- 电路板设计：焊盘应对称，避免在电容端子附近形成应力集中；远离板边和连接孔以减少裂纹风险。
- 机械应力：0603 体积虽小但对弯曲和冲击敏感，插件与测试时避免对器件施加侧向力。
- 贮存与贴装前处理：建议保持原卷盘包装，干燥保存，贴片后尽快回流，若长期暴露则按湿敏等级（MSL）处理。
六、选型与测试建议
- 测试条件：常用 LCR 表在 1 MHz、0.5 Vrms 条件下测量电容值与损耗。
- 电压降容差：C0G 对直流偏压影响小，但在高场强应用仍建议适度降额使用。
- 替代与兼容：选择同等封装、相同性能（C0G、±5%、50 V）的 MLCC 可互换，关键核对封装尺寸与可靠性等级。
- 质量把控：批次一致性、温度漂移和焊接后可靠性为主要验收项目。
如需更详细的焊接曲线、可靠性测试数据或替代料号建议，可提供具体应用场景与工艺要求，我将给出针对性建议。
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