WMSIC Electronic Components

CL21A226MPCLRNC

ModelCL21A226MPCLRNC
Package0805
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL21A226MPCLRNC
Type
SAMSUNG
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL21A226MPCLRNC
Electronic Component
1
Electronic Component
22uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM69413955
Electronic Component
X5R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CL21A226MPCLRNC 产品概述

一、基本信息概述

CL21A226MPCLRNC 是一款由三星电机(Samsung Electro-Mechanics)制造的多层陶瓷电容器(MLCC),属于 CL 系列。该电容器的额定电压为 10V,额定电容值为 22µF,具有 ±20% 的容差。这款电容器因其卓越的性能和广泛的适用性而广受欢迎,适合多种电子电路的应用场景。

二、设计与规格

  1. 封装与尺寸
    CL21A226MPCLRNC 采用 0805 封装,尺寸为 2.00mm x 1.25mm (0.079" x 0.049"),最大厚度为 0.95mm (0.037")。这样的尺寸设计使得该电容器适合于表面贴装(SMD)应用,能够在有限的电路空间中提供可靠的电容性能。

  2. 温度特性
    此款电容器的温度系数为 X5R,这意味着它在 -55°C 到 +85°C 的广泛温度范围内能够保持稳定的电容值。X5R 型的特点是电容值相对稳定,适合于需要较高稳定性的应用场合。

  3. 电气参数

    • 电容值:22µF
    • 额定电压:10V
    • 容差:±20%

这种电气特性设置使得 CL21A226MPCLRNC 能够在各类电子电路中发挥关键作用,满足对电源旁路、去耦和滤波的需求。

三、应用领域

CL21A226MPCLRNC 多层陶瓷电容器广泛应用于多种电子设备中。一般来说,它主要用于以下几种场景:

  1. 消费电子产品
    在智能手机、平板电脑、笔记本电脑等消费类电子产品中,CL21A226MPCLRNC 可用于电源管理、信号滤波以及用于实现高频旁路的任务,以提高系统的稳定性和可靠性。

  2. 工业设备
    对于工业电子设备,如工控主板及自动控制系统等,提供良好的电压稳定性和高频去耦效能至关重要。此电容器的优良性能能够确保设备在严苛的工作环境下正常运行。

  3. 汽车电子
    近年来,随着汽车电子化的加深,许多汽车控制模块、仪表盘以及导航系统都需要用到小尺寸高容量的电容器。CL21A226MPCLRNC 的耐温性能和小巧设计使其非常适合这一领域的应用。

  4. 通信设备
    在无线通讯、卫星通讯等高频设备中,对电容器的性能有严格的要求。CL21A226MPCLRNC 的低等效串联电阻(ESR)和小电容降率使其成为理想的选择。

四、市场竞争力

作为三星电机出品的一款多层陶瓷电容器,CL21A226MPCLRNC 在市场上享有较高的声誉。以优良的品质和稳定的性能,满足了全球电子制造商日益增长的需求。同时,三星电机在全球电子元件市场上占据了重要的地位,其强大的研发实力和生产能力为客户提供了优质可靠的产品保障。

五、总结

整体来看,CL21A226MPCLRNC 是一款极具竞争力的多层陶瓷电容器,凭借其出色的性能、稳定耐用的特性及广泛的应用场景,满足率先消费电子、工业设备、汽车电子和通信设备等多种行业的需求。无论是在小型、紧凑设计的电子产品,还是复杂的工业电路中,这款电容器都能以其理想的电气性能和出色的热稳定性来有效优化系统整体表现。对于制造商而言,选择 CL21A226MPCLRNC 不仅能提高产品的可靠性,还能在激烈的市场竞争中获得优势。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.