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CL10B103KC84PEC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10B103KC84PEC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10B103KC84PEC
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0265916337
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL10B103KC84PEC 多层陶瓷电容器（MLCC）产品概述
一、产品基本信息
CL10B103KC84PEC是韩国三星（SAMSUNG）半导体推出的通用型多层陶瓷电容器（MLCC），采用X7R介质材料，封装规格为0603（公制对应1608，即1.6mm×0.8mm），属于工业级标准品系。该元件通过成熟的多层陶瓷叠层工艺制造，具备稳定的电气性能与可靠的环境适应性，广泛应用于各类电子设备的信号耦合、电源滤波等场景。
二、核心参数详解
该型号的关键参数可支撑其通用型应用需求，具体如下：
- 容值与精度：标称容值为10nF（103pF），精度等级±10%——实际容量范围为9nF~11nF，满足大多数电路对容量偏差的容忍度；
- 额定电压：100V直流（DC），为长期工作环境下的最大允许电压，可保障设备在正常工况下的安全运行；
- 温度系数：采用X7R介质，其温度特性定义为：工作温度范围-55℃~+125℃，容量变化率≤±15%，温度稳定性优于Y5V等低阶介质；
- 封装尺寸：0603英寸（英制）/1608mm（公制），表面贴装封装，适配标准SMT生产线，支持高密度PCB布局。
三、技术特性与核心优势
- 宽温稳定性突出：X7R介质的温度范围覆盖工业级环境（-55℃~+125℃），容量受温度波动影响小，避免电路性能随环境变化；
- 封装紧凑高效：0603封装体积仅1.6mm×0.8mm，可显著节省PCB空间，适配智能手机、便携式仪器等小型化设备；
- 三星品质保障：采用高精度叠层工艺，容值一致性达行业领先水平，耐电压性能稳定，符合RoHS环保标准，可靠性符合IEC 60384-1国际标准；
- 通用性强：100V额定电压覆盖中等功率需求，10nF容值适配滤波、耦合、旁路等多种通用电路功能，无需针对场景额外选型。
四、典型应用领域
该元件的参数特性使其适配多类电子场景：
- 消费电子：智能手机、平板电脑的电源滤波（DC-DC转换器输出）、音频电路信号耦合；
- 工业控制：PLC、变频器、传感器模块的信号滤波与耦合，保障工业设备抗干扰能力；
- 通信设备：路由器、交换机的射频电路旁路电容、电源滤波，提升信号传输质量；
- 电源设备：LED驱动电源、开关电源的输出滤波，抑制纹波噪声，提高电源效率。
五、可靠性与使用注意事项
- 电压降额建议：实际工作电压不超过额定电压的80%（即80V DC），可延长使用寿命，避免电压应力导致的性能衰减；
- 焊接工艺要求：适配回流焊、波峰焊，焊接峰值温度≤245℃（三星官方推荐），避免过热损坏介质；
- 存储条件：未开封产品存储于-40℃~+60℃、相对湿度≤60%环境，开封后12个月内使用完毕，防止介质吸潮。
该型号凭借三星的工艺优势与通用型参数，成为电子设备设计中高频选用的基础元件之一，可满足大多数中低端场景的稳定运行需求。
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