WMSIC Electronic Components

CL10B103KB8WPJC

ModelCL10B103KB8WPJC
Package0603
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL10B103KB8WPJC
Type
SAMSUNG
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL10B103KB8WPJC
Electronic Component
1
Electronic Component
10nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0265989034
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CL10B103KB8WPJC 陶瓷电容器产品概述

一、产品核心身份识别

CL10B103KB8WPJC是三星电子(SAMSUNG) 推出的多层陶瓷电容器(MLCC),属于通用型中高压陶瓷电容系列。该型号以X7R温度系数为核心特性,适配0603(英制)/1608(公制)小型封装,主要面向对体积紧凑性、温度稳定性有要求的电子电路设计场景,是三星MLCC产品线中覆盖中低压通用需求的经典型号。

二、关键参数规格

CL10B103KB8WPJC的核心参数明确且符合工业标准,具体如下:

  • 容值:10nF(即10000pF),标注代码为“103”(10×10³pF);
  • 精度:±10%(国际代码“K”),满足大多数通用电路的容值偏差需求;
  • 额定电压:50V(直流/交流兼容),可稳定工作在50V以下的电压环境;
  • 温度系数:X7R,工作温度范围为**-55℃~+125℃**,此范围内容值变化≤±15%,温度稳定性优于Y5V等低价系列;
  • 辅助参数:绝缘电阻≥10⁹Ω(25℃,10V DC),损耗角正切≤1.0%(1kHz,25℃),符合陶瓷电容的常规性能要求。

三、封装与尺寸细节

该型号采用0603封装(英制命名:0.06英寸×0.03英寸),对应公制规格为1608(1.6mm×0.8mm),具体尺寸参数如下:

  • 长度(L):1.6±0.2mm;
  • 宽度(W):0.8±0.2mm;
  • 厚度(T):0.8±0.2mm(典型值);
  • 电极间距:约0.5mm,适配常规贴片焊接工艺;
  • 封装材料:陶瓷介质+镍电极(符合无铅环保要求),电极端镀锡处理,提升焊接可靠性。

四、核心特性与优势

CL10B103KB8WPJC的设计聚焦“小体积+稳定性能”,核心优势体现在:

  1. 宽温稳定性:X7R温度系数使其在-55℃至125℃范围内保持容值稳定,避免极端温度下电路性能波动;
  2. 高可靠性:三星成熟的MLCC制造工艺(薄介质层、均匀电极)确保低损耗、高绝缘电阻,减少漏电和失效风险;
  3. 小型化适配:0603封装体积小巧,可有效降低电路布局空间,适合便携式设备和高密度PCB设计;
  4. 成本可控:±10%精度和通用型设计平衡了性能与成本,无需高精度需求的场景下性价比突出;
  5. 环保合规:符合RoHS 2.0、REACH等国际环保标准,无铅无镉,适配绿色电子产品设计。

五、典型应用场景

该型号因参数适配性强,广泛应用于多领域电子设备:

  1. 消费电子:智能手机、平板电脑、智能手表的电源滤波、信号耦合、去耦电路;
  2. 汽车电子:车载信息娱乐系统、辅助驾驶传感器(如摄像头、雷达)的滤波电路(部分批次通过AEC-Q200认证,满足汽车级可靠性要求);
  3. 工业控制:PLC(可编程逻辑控制器)、变频器、伺服驱动器的电源滤波和信号处理电路;
  4. 通信设备:路由器、交换机、基站的射频电路滤波、直流电源去耦;
  5. 医疗仪器:小型家用医疗设备(如血压计、血糖仪)的电源模块,依赖其稳定的温度特性和可靠性。

六、品牌与可靠性保障

三星电子作为全球领先的MLCC供应商,其产品通过严格的质量管控体系:

  • 生产过程遵循ISO 9001、IATF 16949(汽车行业)等认证标准;
  • 批次一致性高,每批产品均经过容值、电压、温度特性等全项检测;
  • 售后支持完善,提供技术文档和样品验证服务,适配客户研发需求。

综上,CL10B103KB8WPJC是一款性能稳定、体积小巧、应用广泛的通用型陶瓷电容,可满足多数电子设备的中低压滤波、耦合需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.