Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
品牌: SAMSUNG(三星)
封装类型: 0603(1608公制)
电容类型: 多层陶瓷电容器(MLCC)
安装方式: 表面贴装
电压额定值: 10V
电容值: 1µF
容差: ±10%
温度系数: X7R
工作温度范围: -55°C至125°C
最大厚度: 0.035"(0.90mm)
尺寸: 0.063" 长 x 0.031" 宽(1.60mm x 0.80mm)
CL10B105KP8NNNC是三星电子公司生产的一款高性能多层陶瓷电容器。该产品具有优异的电气性能和温度稳定性,广泛应用于各种电子设备中,适用于需要小型化和高可靠性的场景。
高压耐受性和可靠性
CL10B105KP8NNNC的额定电压为10V,适合许多通用应用,确保在高压环境下的稳定运行。
温度适应性
具备-55°C至125°C的宽广工作温度范围,能够应对不同应用场合的环境变化,尤其适用于汽车电子、工业设备及其他高温环境中的应用。
高频性能
X7R温度系数确保了电容器在电压和温度变动时的稳定性,使其在高频电路中表现良好,适合用于滤波、耦合和去耦等多种场合。
体积小、轻巧
尺寸仅为0.063" x 0.031"(1.60mm x 0.80mm)的0603封装设计,使得该电容器在紧凑的电路设计中嵌入非常方便,对于现代电子产品的小型化至关重要。
CL10B105KP8NNNC可以广泛应用于以下行业及产品中:
消费电子
作为手机、平板电脑、笔记本电脑等消费电子产品中的去耦或滤波电容,保障设备正常工作,减小噪声干扰。
汽车电子
在汽车控制单元(ECU)、传感器及信息娱乐系统中,提供稳定的电源和信号耦合,满足汽车行业对配件耐用性和安全性的高要求。
工业控制
在PLC控制、传感器接口等工业自动化设备中,发挥去耦和信号滤波的作用,提高系统可靠性。
通信设备
在射频(RF)设备、基站等无线通信设备中,作为重要的滤波元件,保证信号的清晰度和系统的稳定性。
三星作为全球领先的电子元器件制造商,其产品具有高品质标准和强大的技术支持。CL10B105KP8NNNC凭借其卓越的电气性能、广泛的应用范围和高可靠性,能够在激烈的市场竞争中脱颖而出。此外,三星的强大供应链也确保了产品的及时交付和稳定供货。
综上所述,CL10B105KP8NNNC是一款性能优异、适应性强的小型多层陶瓷电容器,适用于多种不同的电子应用。其极高的可靠性、广泛的使用温度范围以及小型封装特性,使其成为现代电子设备设计中的理想选择。无论是在消费电子、汽车电子、工业控制还是通信设备中,CL10B105KP8NNNC都能为设计者提供卓越的性能保证,推动电子产品向更高水平的发展。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products