WMSIC Electronic Components

CL10C150JB81PNC

ModelCL10C150JB81PNC
Package603
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SAMSUNG CL10C150JB81PNC
Type
SAMSUNG
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL10C150JB81PNC
Electronic Component
1
Electronic Component
15pF
Package
603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0265916348
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

三星CL10C150JB81PNC MLCC产品概述

一、产品核心参数

三星CL10C150JB81PNC属于C0G类多层陶瓷电容(MLCC),核心参数明确且适配多数中低电压电路需求,具体如下:

  • 容值与精度:15pF,精度±5%,满足一般电路对容值误差的控制要求;
  • 额定电压:50V DC,覆盖消费电子、工业控制等场景的常规电压范围;
  • 温度特性:C0G(对应NP0),容值温度系数≤±30ppm/℃,在-55℃~+125℃宽温范围内容值变化可忽略;
  • 封装尺寸:0603英制(公制1608),典型尺寸为1.6mm×0.8mm×0.8mm,适配高密度贴装;
  • 端子处理:镍锡(Ni/Sn)端子,焊接兼容性强,支持回流焊、波峰焊等主流工艺。

二、产品核心特性

该型号因平衡了稳定性、体积与可靠性,成为多场景的优选电容:

  1. 超宽温容值稳定:C0G介质的核心优势是容值随温度/电压变化极小,避免射频电路频率漂移、数字电路噪声干扰;
  2. 低损耗低噪声:1kHz下损耗角正切(tanδ)≤0.15%,高频(如2.4GHz)下损耗进一步降低,适合射频前端;
  3. 小体积高密度:0603封装是消费电子、小型工业设备的主流选择,可有效缩小PCB面积,提升集成度;
  4. 高可靠性长寿命:采用三星先进陶瓷叠层工艺,抗机械振动(10g~2000Hz)、耐湿热(85℃/85%RH环境1000小时无失效),符合工业级要求;
  5. 环保合规:无铅无卤,符合RoHS 2.0、REACH SVHC等指令,适配全球绿色产品设计。

三、典型应用场景

该型号因性能均衡,广泛应用于以下领域:

  1. 高频通信模块:蓝牙、WiFi、5G Sub-6GHz射频前端的谐振、耦合、滤波电路,确保信号传输稳定;
  2. 数字电路去耦:CPU、FPGA、DDR内存周边的旁路电容,快速滤除高频噪声,提升数字信号质量;
  3. 精密测量仪器:示波器、信号发生器、传感器前端的参考电容,避免温度变化导致的测量误差;
  4. 消费电子终端:智能手机、平板电脑、智能手表的电源滤波、信号耦合,适配小型化设计;
  5. 工业控制电路:PLC、传感器节点的电源稳压、信号滤波,满足工业环境宽温与可靠性要求。

四、型号解析与选型参考

理解型号各段含义可精准匹配需求:

  • CL10:三星常规MLCC系列,覆盖C0G、X7R等介质,电压范围10V~100V;
  • C:温度特性(C0G/NP0),容值稳定;若为X7R则温度范围-55℃~+125℃,容值变化±15%;
  • 150:容值代码(前两位有效数字+第三位幂次),即15×10⁰=15pF;151=150pF,152=1.5nF;
  • J:精度±5%,若需更高精度可选F(±1%),更低成本可选K(±10%);
  • B:电压等级(50V),C=100V,J=6.3V等;
  • 81:封装代码(0603英制=1608公制);
  • PNC:卷带包装(10000pcs/卷)+镍锡端子。

选型提示:若需100V电压可选CL10C150JC81PNC,更小体积(0402)可选CL05系列。

五、可靠性与认证

该型号通过多项国际标准测试,确保应用安全:

  • 国际标准:符合IEC 60384-1、JIS C 5102等电子电容器通用标准;
  • 环境测试:温度循环(-55℃~+125℃,500次)、湿热测试(85℃/85%RH,1000小时)均无失效;
  • 焊接认证:兼容无铅回流焊(峰值245℃),端子焊接强度≥2N,避免虚焊;
  • 质量体系:三星MLCC生产遵循ISO 9001、IATF 16949(汽车级可选)等质量体系。

该型号凭借稳定的性能与可靠的品质,成为消费电子、通信、工业等领域的高性价比MLCC选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.