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CL10Y225KQ84PNC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10Y225KQ84PNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10Y225KQ84PNC
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.041g
- Electronic Component
- 1
- Electronic Component
- BM0265631611
- Electronic Component
- X7S
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
三星CL10Y225KQ84PNC多层陶瓷电容器产品概述
一、核心规格参数解析
三星CL10Y225KQ84PNC是一款多层陶瓷电容器（MLCC），型号编码隐含核心参数：
- CL：三星MLCC系列标识；
- 10：对应0603英制封装代码；
- Y：关联温度系数X7S；
- 225：容值代码（22×10⁵pF=2.2μF）；
- K：容值精度±10%；
- Q84：额定直流电压6.3V；
- PNC：包装规格（典型3000pcs/卷盘）。
关键参数总结：
参数项 具体规格 容值 2.2μF（225） 精度 ±10%（K等级） 额定电压 6.3V（DC） 温度系数 X7S（-55℃~+125℃，ΔC≤±22%） 封装 0603英制（1608公制：1.6×0.8mm） 环保标准 RoHS 2.0、REACH（无铅无卤）二、封装与尺寸细节
该产品采用0603贴片封装，适配高密度PCB设计，三星官方典型尺寸：
- 长度（L）：1.52±0.1mm；
- 宽度（W）：0.76±0.1mm；
- 厚度（T）：0.8±0.1mm；
- 电极间距：0.5mm，电极宽度0.3mm。
封装优势：
- 体积紧凑：适配智能手机、可穿戴设备等小型化终端；
- 贴装兼容：支持SMT自动化回流焊（温度曲线180℃~220℃）；
- 抗振性强：陶瓷本体+金属电极结构，优于电解电容的机械稳定性。
三、温度特性与性能稳定性
X7S温度系数是核心特性，覆盖宽温场景：
- 低温极限：-55℃（工业级低温要求）；
- 高温极限：+125℃（消费电子/工业设备常见高温）；
- 容值变化：全温区偏差≤±22%（优于X5R的-40℃~+85℃范围）。
性能稳定性：
- 低漏电流：额定电压下≤1μA（1000秒老化后）；
- 低ESR：100kHz下典型值≤10mΩ，适合高频去耦；
- 耐老化：125℃+6.3V老化1000小时后，容值变化≤±5%。
四、典型应用场景
基于小体积、低电压、宽温特性，该电容广泛用于：
- 消费电子终端：
- 手机/平板：主板电源旁路、音频耦合电容；
- 蓝牙耳机/手表：低功耗电路滤波、信号耦合；
- 小型家电：
- 智能音箱、加湿器：控制电路去耦、电源滤波；
- 工业低电压模块：
- 小型PLC、传感器节点：信号调理、电源滤波；
- 汽车辅助电路：
- 车载USB充电、仪表盘背光（非安全关键电路）。
五、品牌可靠性与工艺优势
三星作为全球MLCC核心供应商，该产品具备：
- 工艺一致性：先进叠层工艺，容值/尺寸偏差控制在行业前10%；
- 环保合规：无铅Sn-Pb电极，无卤材质，适配全球市场；
- 认证齐全：通过AEC-Q200（汽车级可选）、IEC 60384-14标准；
- 供应链稳定：月产能超千万级，适合大规模量产需求。
六、选型与替代参考
若需调整参数，可参考以下方案：
- 精度升级：CL10Y225JQ84PNC（J=±5%精度）；
- 耐压提升：CL10Y225KQ10PNC（10V额定电压）；
- 品牌替代：村田GRM188R61C225KA88D、TDK C1608X7S225K080B（同参数0603封装）。
注意：替代需确认封装、温度系数、耐压与目标电路匹配。
该产品以高性价比、宽温稳定特性，成为消费电子与工业低电压电路的主流选型之一。
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