WMSIC Electronic Components

CL10B472KC8WPNC

ModelCL10B472KC8WPNC
Package0603
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL10B472KC8WPNC
Type
SAMSUNG
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL10B472KC8WPNC
Electronic Component
1
Electronic Component
4.7nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0265062332
Electronic Component
X7R
Voltage
100V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

三星CL10B472KC8WPNC多层陶瓷贴片电容(MLCC)产品概述

一、产品基本定位

该型号为三星电子推出的通用型中高压多层陶瓷贴片电容(MLCC),针对高密度PCB设计优化,核心适配消费电子、工业控制、通信设备等领域的电源滤波、信号耦合、旁路电路需求,兼具宽温稳定性与小型化优势。

二、核心参数详细说明

1. 容值与精度

标称容值为4.7nF(采用3位标识法:47×10²=4700pF=4.7nF),精度等级为**±10%**,满足多数通用电路对容值一致性的要求,批量生产偏差控制严格。

2. 额定电压

额定直流电压为100V,可稳定工作在直流100V及以下电压环境,适配24V/48V等中低压电源系统(如工业PLC电源、消费电子DC-DC转换器)。

3. 温度系数

采用X7R陶瓷介质,温度特性符合EIA标准:

  • 工作温度范围:-55℃至+125℃
  • 容值变化率:在此温度范围内不超过**±15%**,兼顾宽温适应性与容值稳定性(优于Y5V介质,容值密度高于NPO/COG介质)。

4. 封装尺寸

0603英制封装(对应公制1608),具体物理参数(典型值):

  • 长度:1.6mm±0.1mm
  • 宽度:0.8mm±0.1mm
  • 厚度:0.8mm±0.1mm
    适配高密度PCB布局,可有效减少电路占用面积。

三、封装与介质特性

1. 封装结构

  • 电极材质:镍-锡(Ni-Sn),表面贴装工艺兼容性好,支持回流焊、波峰焊等主流工艺;
  • 封装形式:无引线贴片封装,焊接可靠性高,抗机械应力能力优于插件电容。

2. 介质材料

X7R陶瓷介质是通用MLCC的主流选择,相比其他介质的优势:

  • 比NPO(COG)容值密度高3~5倍,适合小体积实现大容量;
  • 比Y5V温度稳定性好,避免极端温度下容值大幅漂移。

四、典型应用场景

1. 消费电子领域

  • 智能手机、平板电脑:电源管理模块(DC-DC转换器滤波、电池充电电路旁路);
  • 笔记本电脑:主板辅助电路滤波,提升供电稳定性。

2. 工业控制设备

  • PLC(可编程逻辑控制器)、变频器:辅助电路滤波,适应工业环境宽温(-40℃至+85℃)需求;
  • 伺服驱动器:信号耦合与旁路,减少电磁干扰。

3. 通信设备

  • 路由器、交换机:电源滤波与信号耦合,适配设备高密度PCB设计;
  • 基站辅助电路:中低压电源模块滤波。

4. 小家电产品

  • 智能家居设备(智能音箱、扫地机器人):电源电路滤波,提升电路可靠性。

五、性能与可靠性优势

1. 宽温稳定

X7R介质支持-55℃至+125℃工作范围,可适应高温工业场景(如变频器柜)或低温户外设备(如监控摄像头)。

2. 高可靠性

  • 三星采用自动化多层陶瓷叠层工艺,电极与介质结合紧密,耐电压冲击能力强;
  • 符合IEC 60384-1国际标准,通过高温存储(125℃/1000h)、温度循环(-55℃~+125℃/1000次)等可靠性测试。

3. 低损耗

1kHz/25℃条件下,损耗角正切(tanδ)典型值≤1%,减少电路能量损耗,提升电源效率。

4. 环保合规

符合RoHS 2.0、REACH等环保指令,不含铅、镉等有害物质,适配全球市场需求。

六、品质保障与认证

  • 生产工艺:自动化叠层、烧结、印刷工艺,批量一致性好,参数偏差控制在规格范围内;
  • 认证资质:具备UL、VDE等国际安全认证,满足不同行业的合规要求;
  • 寿命保障:额定条件下(100V/25℃)使用寿命可达数千小时,长期工作可靠性高。

该型号是三星MLCC系列中兼顾性价比与性能的通用型产品,适用于对容值精度、温度稳定性有要求的中低压电路场景。

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