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CL10X106MP8NRNC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10X106MP8NRNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10X106MP8NRNC
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0259546691
- Electronic Component
- X6S
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL10X106MP8NRNC
概述 CL10X106MP8NRNC是一款由三星（SAMSUNG）生产的表面贴装多层陶瓷电容器（MLCC）。该产品以其优越的性能和可靠的质量，在电子行业中被广泛应用，特别是在消费电子、通信设备和工业应用领域。凭借其小型封装和灵活的电气特性，CL10X106MP8NRNC能够满足现代电子设备对小型化、轻量化和高效能的需求。
基础参数 该电容器的容量为10µF，额定电压为10V，具有±20%的容差范围，适用的工作温度范围为 -55°C 至 105°C。其厚度最大值为0.035"（约0.90mm），在0603（1608公制）封装中，具有长0.063"（约1.60mm）和宽0.031"（约0.80mm）的精密尺寸，使其能够轻松融入各种电路设计中，且不占用过多的空间。
电气特性 CL10X106MP8NRNC拥有X6S温度系数，这意味着该电容器在温度变化时，电容值的变化量相对较小，具有良好的稳定性。这一特性使得该电容器非常适合在温度波动较大的环境中工作。它的低ESR（等效串联电阻）特性使其在高频应用中表现优异，有效降低了信号失真并提高了电源去耦及滤波效果。此外，广泛的频率响应使其在不同的工作条件下维持稳定的电容值，从而确保电路运行的可靠性。
表面贴装技术（SMT） CL10X106MP8NRNC采用表面贴装技术，简化了现有电路的设计和制造过程。其小尺寸使得在密集电路中集成多种元件成为可能。这种封装方式不仅降低了生产成本，还提高了组件的安装效率，适用于自动化生产流程。此外，全贴片设计使其具备更好的抗震性和稳定性，能够承受高温焊接过程。
应用领域 作为一款通用型电容器，CL10X106MP8NRNC可用于多种应用场景，包括但不限于：
- 消费电子：广泛应用于手机、平板电脑、智能穿戴设备等消费电子产品中。
- 通信设备：在无线通信、网络设备及基站的信号处理及滤波电路中表现出色。
- 自动化设备：适用于各种工业控制器、传感器模块及机器人技术中。
- LED驱动电路：在LED照明及显示产品中，有效提升电源的稳定性。
总体评价 总体而言，CL10X106MP8NRNC是一款出色的表面贴装多层陶瓷电容器，结合了小巧的尺寸、优秀的电气性能和高温稳定性，能够满足当前电子产品对小型化和高效能的苛刻要求。作为三星的高品质产品，用户可以信赖其在各种应用中的可靠表现，是现代电子设计中不可或缺的核心元件之一。
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