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CL10Y225KQ8VPNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10Y225KQ8VPNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10Y225KQ8VPNC
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0257686768
- Electronic Component
- X7S
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL10Y225KQ8VPNC 产品概述
一、产品简介
CL10Y225KQ8VPNC 为三星（SAMSUNG）生产的一款0603封装多层陶瓷电容（MLCC），额定容量 2.2µF，公差 ±10%（K），额定电压 6.3V，介质温度系数 X7S。该器件为无极性元件，体积小、频率响应好，适用于对体积和性能要求较高的表面贴装电路。
二、主要电气与机械参数
- 容值：2.2µF
- 精度：±10%（K）
- 额定电压：6.3V DC
- 温度系数：X7S（工作温度范围通常为 −55°C 至 +125°C，随温度容值变化受介质特性影响）
- 封装：0603（典型尺寸 1.6 × 0.8 mm）
- 极性：无极性（可任意方向贴装）
三、特点与优势
- 高容值/体积比：在0603小封装中实现较大容量，节省 PCB 面积，适合空间受限的移动终端与消费类电子。
- 宽温稳定性：X7S 介质在宽温范围内比 Y5V 等更稳定，适用于大多数工业与民用环境。
- 低等效串联电阻（ESR）与低等效串联电感（ESL）：有利于高频去耦、瞬态响应和 EMI 滤波。
- 可靠性：三星制造工艺成熟，一致性和良率较好（实际可靠性应参照厂商数据表及应用测试）。
四、应用场景
- 电源去耦与旁路：CPU、PMIC、SoC 的电源输入/输出去耦。
- DC-DC 转换器输入/输出滤波与储能。
- 移动终端、物联网设备、可穿戴设备等对体积敏感的消费类电子。
- 模拟前端滤波、耦合/去耦电路（非直流耦合关键场合需考虑容值与偏压影响）。
五、设计与使用建议
- 注意直流偏置效应：在 6.3V 工作电压下，陶瓷电容的有效容值会因 DC 偏压而显著下降，应用时请在目标工作电压条件下验证实测容值；必要时考虑提高额定电压或使用更大封装以保证有效容量。
- 温度影响：X7S 在低温或高温端仍能保持较好性能，但极端温度下容值会有变化，应在系统温度范围内测试验证。
- 焊接与回流：兼容无铅回流工艺，建议遵循厂商推荐的回流曲线（峰值温度通常 ≤ 260°C）以避免热损伤。
- 封装与布局：为减小机械应力，推荐采用厂商推荐的焊盘尺寸与过孔走线策略，贴片后避免强烈弯折或局部应力集中。
- 环境与存储：湿敏等级和包装请参照出货时标签，必要时进行回流前烘烤以防吸湿导致焊接缺陷。
六、注意事项与限制
- 非极性但非电解电容，不能用作大能量储存与替代电解电容在高直流偏压场合的作用。
- 小封装大容量可能带来更明显的 DC 偏压与温度依赖性，关键指标请做实测验证。
- 机械冲击和压应力可能导致裂纹或功能衰减，产品设计时应考虑振动与落差条件。
结语：CL10Y225KQ8VPNC 在 0603 尺寸中提供较高的容值与良好的高频特性，适合移动与消费电子中对去耦与滤波有较高密度要求的场合。最终选型建议结合实际工作电压、温度、机械环境及 PCB 布局进行验证，并参考三星官方数据手册和可靠性测试结果。
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