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CL21B103KCANNNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL21B103KCANNNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL21B103KCANNNC
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0264356864
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL21B103KCANNNC 产品概述
产品简介
CL21B103KCANNNC 是三星（SAMSUNG）旗下的一款表面贴装多层陶瓷电容器（MLCC），其具有广泛的应用场景。其主要参数包括10000pF（10nF）的电容值，额定电压为100V，温度系数为X7R，容差为±10%。该产品适用于电路中的能量存储、滤波、耦合及去耦等多种用途，尤其适合在高温及高电压环境中使用。
关键规格
- 安装类型: 表面贴装（SMD），MLCC
- 厚度（最大值）: 0.030"（0.75mm）
- 大小 / 尺寸: 0805 封装(即 2.00mm x 1.25mm)
- 电容: 10000pF (10nF)
- 工作温度范围: -55°C 至 125°C
- 额定电压: 100V
- 温度系数: X7R
- 容差: ±10%
应用场景
CL21B103KCANNNC 的设计使其能够在各种极端条件下工作，非常适合用于汽车电子、消费电子、数据处理设备等领域。具体应用包括：
- 滤波: 在电源管理电路中，该电容器可以抑制高频噪声，改进电源的稳定性。
- 去耦: 用于去耦电路中，以减少由电压突变引起的干扰，确保信号的清晰度与稳定性。
- 耦合: 在音频和信号通道中用作耦合电容器，允许交流信号通过而阻挡直流成分。
- 能量存储: 在一些瞬时能量需求的电路中，该电容器的快速充放电特性提供短时间内的能量供给。
产品优势
- 高温稳定性: 其工作温度范围广，尤其是在高温环境下（最大125°C）依然能保持稳定性能，适合汽车和工业应用。
- 小型化: 0805的封装尺寸使其适应极其紧凑的电路设计，能够满足小型设备对空间的严格要求。
- 可靠性: 陶瓷电容的特性使其在长时间使用中表现出色，降低了因组件失效而引起的电路故障风险。
- 低损耗: X7R 料号的温度系数，意味着即使在大范围的工作温度下，电容器的电气特性变化也非常小。
使用建议
在使用 CL21B103KCANNNC 电容器时，需要注意以下几点：
- 安装注意: 确保正确的极性和安装方向，避免由于装配失误导致的电路故障。
- 环境条件: 确保电容器在其额定温度和电压范围内运作，以保证最佳性能。
- 电源管理: 在设计电源管理电路时，充分考虑电容器的容量与工作电压，避免超负荷工作。
- PCB布局: 合理布局和适当的焊接技术可以提高电容器的性能和整个电路的可靠性。
结论
三星 CL21B103KCANNNC 表面贴装多层陶瓷电容器以其卓越的性能、广泛的用途和可靠的工作特性，成为现代电子电路设计中的重要组成部分。无论是用于高频滤波、直流去耦，还是作为耦合电容，它都能够为设计师提供强大的支持，并帮助提升最终产品的质量。选择这一产品，将会为您在电路设计中带来更多的灵活性与效率。
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