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CL10B105KB9VPNC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10B105KB9VPNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10B105KB9VPNC
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0259012505
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL10B105KB9VPNC — SAMSUNG 车规级 0603 X7R 1µF/50V 电容 产品概述
一 产品简介
CL10B105KB9VPNC 是三星（SAMSUNG）推出的车规级多层陶瓷电容（MLCC），封装为 0603（公制 1608），标称容量 1µF，公差 ±10%，额定电压 50V，介质类型 X7R。封装厚度 0.9mm，面向汽车电子对可靠性与温度稳定性要求较高的应用场景设计。
二 主要参数
- 容值：1.0 µF（±10%）
- 额定电压：50 V DC
- 温度特性：X7R（工作温度范围 -55°C ~ +125°C，温度引起的电容变化在该介质规范范围内）
- 封装：0603（1608 公制），厚度 0.9 mm
- 品牌：SAMSUNG（车规级）
- 包装方式：适配自动贴片机的卷带包装（Reel）
三 特性与优势
- 车规级设计：针对汽车工作环境进行了可靠性优化，满足高温、振动与湿热等环境考核（可参考 AEC‑Q200 类测试项）。
- X7R 介质：在较宽温度范围内保持良好电容值稳定性，适合去耦与旁路场合。
- 高体积容值：0603 封装即可实现 1µF，该尺寸在空间受限的车载电子中具有优势。
- 工艺稳定：厚度 0.9mm 提供更好的机械强度和热稳定性，利于波峰/回流焊接工艺。
四 典型应用
- 汽车车身与底盘控制单元（ECU）去耦与滤波
- 电源管理模块、DC‑DC 转换器输入/输出旁路
- 仪表盘、信息娱乐系统与摄像头模组的电源去耦
- 传感器与通讯模块抗干扰设计
五 设计注意事项
- 直流偏压效应：X7R MLCC 在施加直流电压时会出现电容下降，应在电路设计时考虑实际工作电压下的有效电容。
- 温度与频率特性：X7R 在极端温度或高频时电容可能偏离标称值，关键电路应验证实际工作条件下的性能。
- 退让与冗余：车规应用建议采用合理的电压/温度退让策略以及必要的冗余设计以提升可靠性。
- 焊接应力：避免 PCB 弯曲和过度机械应力，合理设计焊盘尺寸与焊膏分布以降低应力集中。
六 存储与贴装建议
- 遵循常规芯片电容防潮储存与回流焊前干燥说明（若为吸湿敏感元件则按厂家建议脱湿）。
- 推荐使用符合尺寸的贴片机程序与回流曲线，并在首件验证时检查焊点质量与电容参数一致性。
七 结论与选型建议
CL10B105KB9VPNC 以其 0603 小型化封装、1µF 的高容值及车规级可靠性适合用于对体积、可靠性和温度范围有较高要求的汽车电子电源与去耦场景。选型时请结合实际工作电压、温度和直流偏压条件，必要时参考三星官方详细数据手册或向供应商索取电容随偏压/温度的实测曲线以确保设计裕度。
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