Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL31A476MQHNNNE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- SAMSUNG CL31A476MQHNNNE
- Type
- SAMSUNG
- Unit
- Electronic Component
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL31A476MQHNNNE
- Electronic Component
- 1
- Electronic Component
- 47uF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.074g
- Electronic Component
- 1
- Electronic Component
- BM69413636
- Electronic Component
- X5R
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL31A476MQHNNNE - SAMSUNG 47µF 6.3V X5R 增值表面贴装多层陶瓷电容器
1. 产品简介
CL31A476MQHNNNE是来自三星（SAMSUNG）的一款高性能表面贴装多层陶瓷电容器（MLCC）。该电容器的额定电压为6.3V，电容值为47µF，采用X5R温度系数设计。其紧凑的1206封装尺寸（3.20mm x 1.60mm）使得这一元件在空间受限的应用中表现尤为优越。CL31A476MQHNNNE适合多种通用应用，特别是在消费电子、工业设备和汽车电子等领域。
2. 规格参数
- 安装类型: 表面贴装 (SMD)
- 封装尺寸: 1206（3.20mm x 1.60mm）
- 电容值: 47µF
- 额定电压: 6.3V
- 工作温度范围: -55°C ~ 85°C
- 温度系数: X5R
- 厚度: 最大0.071"（1.80mm）
- 容差: ±20%
3. 温度系数 - X5R
X5R是一种非常常用的陶瓷电容器温度系数，其特点是能够在-55°C到+85°C的温度范围内维持相对稳定的电容值。在工作温度变化范围内，电容值变化低于15%。对于需要高稳定性与宽环境适应性的应用，X5R是非常理想的选择。
4. 应用领域
CL31A476MQHNNNE适用于多种应用，包括但不限于：
- 消费电子产品: 手机、平板电脑、电视、音响及其他高清视频/音频设备。
- 计算机及其周边设备: 主机板、存储器、打印机和其他周边外设的去耦和滤波应用。
- 工业控制: 工业自动化设备中所需的去耦和滤波，确保信号完整性。
- 电源管理: 在DC-DC转换器和其他电源管理电路中，为电源进行滤波以降低输入和输出噪音。
- 汽车电子: 支持汽车内部电子设备的稳定运行，包括音响系统、仪表盘、导航及其它高级驾驶辅助系统（ADAS）。
5. 性能优势
- 小型化设计:1206的封装允许更高的系统密度，这对于现代电子产品尤其重要。
- 高电容值: 47µF的电容提供了优秀的去耦和滤波性能，适合更多电路设计需求。
- 温度稳定性: 在极端温度条件下表现卓越，确保长时间稳定运行，减少故障率。
- 低ESR特性: 多层陶瓷电容器的低等效串联电阻（ESR）特性帮助降低电源噪声，提高电源效率。
6. 选择理由
选择CL31A476MQHNNNE，用户将获得三星的质量保证和信赖度，符合国际标准的制造工艺，确保产品在各种应用场景下的可靠性。同时，凭借其小巧的尺寸和高容量，能够充分应对现代电子产品对体积与性能的双重需求。在各种通用电子产品中，选择CL31A476MQHNNNE，不仅可以优化设计空间，还能够提升产品的功能性和稳定性。
结论
综上所述，CL31A476MQHNNNE是一款性能卓越、可靠性高的多层陶瓷电容器。凭借其出色的电气特性和适应广泛应用的能力，三星的这款产品理应成为设计工程师和采购人员的首选。无论是在消费电子、工业、计算机还是汽车领域，CL31A476MQHNNNE都展现出了优秀的性能，为现代电子产品提供了强有力的电气支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
