Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL21B474KBFNNNE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL21B474KBFNNNE
- Type
- SAMSUNG
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL21B474KBFNNNE
- Electronic Component
- 1
- Electronic Component
- 470nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM69414118
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL21B474KBFNNNE 产品概述
产品背景
CL21B474KBFNNNE 是一款由三星电子（SAMSUNG）制造的多层陶瓷电容（MLCC），参数突出，广泛应用于各类电子设备中。该电容具有出色的电气性能和可靠性，并采用表面贴装（SMD）技术，适合现代高密度电路板的需求。
主要规格
- 电容值: 0.47µF (470nF)
- 容差: ±10%
- 额定电压: 50V
- 温度系数: X7R
- 工作温度范围: -55°C ~ 125°C
- 封装尺寸: 0805 (2.00mm x 1.25mm)
- 厚度: 最大 1.35mm
结构与特性
CL21B474KBFNNNE 的核心技术特色在于其采用的多层陶瓷结构，这种设计使其具备了高的电容值和良好的稳定性。X7R 温度系数保证了电容器在较宽的温度范围内（-55°C 至 125°C）依然能够保持相对稳定的电容值，适用于高温和低温的极端环境。
电容的容差为 ±10%，这意味着在使用过程中能够提供相对一致的电性能，确保其在电路中的作用得以恰当发挥。而其额定电压为 50V，适合很多应用场景，如电源管理、滤波器和耦合电路等。
应用领域
CL21B474KBFNNNE 由于其优异的性能，适合于多种应用，具体包括但不限于：
- 消费电子: 如智能手机、平板电脑、笔记本电脑等。
- 工业设备: 用于电机控制和信号处理。
- 汽车电子: 适合于汽车控制单元和传感器应用。
- 通信设备: 如基站和路由器等高速数据传输装置。
此外，由于其小巧的0805封装，CL21B474KBFNNNE 可以在空间受限的设计中得以应用，满足现代产品的轻薄需求。
可靠性与质量
三星作为全球知名的电子元器件供应商，其生产的陶瓷电容器在可靠性和质量控制方面具有良好的口碑。产品经过严格的品质检测，确保每一批次均符合国际标准，能够在经济性和高性能之间找到最佳平衡。
选择理由
- 高性价比: 该产品能够以较低的成本为用户提供相对较高的性能。
- 稳定性强: X7R 温度系数的使用，使得 CL21B474KBFNNNE 在多变的环境中仍能保持较好的工作性能。
- 广泛的适用性: 无论是消费电子、工业应用还是汽车电子，该电容适用性广泛，能够很好地满足现代电子设备复杂的需求。
总结
CL21B474KBFNNNE 是一款优秀的陶瓷电容，凭借其高性能、可靠性和经济性，成为当今电子产品设计中不可或缺的组件之一。随着电子产品朝着小型化和高性能化的发展趋势不断推进，CL21B474KBFNNNE 在未来将继续扮演重要的角色，满足日益增长的市场需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
