Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL21X226MQQNNNE 是由三星电子机械(Samsung Electro-Mechanics)制造的多层陶瓷电容器(MLCC),属于CL系列。这个产品是广泛应用于各种电子设备中的关键组件,特别适用于需要高可靠性和稳定性能的场景。
CL21X226MQQNNNE 采用高质量的陶瓷材料和先进的制造工艺,确保了其在各种环境条件下的高可靠性。其工作温度范围从-55°C到105°C,这使得它能够在极端温度条件下保持稳定性能。
该电容器采用0805封装,这是一种常见且紧凑的封装形式,适合现代电子设备对空间效率的要求。其尺寸为2.00mm x 1.25mm x 1.40mm,非常适合于小型化设计。
CL21X226MQQNNNE 适用于各种通用应用,包括但不限于消费电子、工业控制、汽车电子、医疗设备等领域。其通用性使其成为设计工程师的首选组件。
X6S 温度系数保证了电容值在整个工作温度范围内的稳定性,失真极小。这对于需要精确电容值和低噪声性能的应用尤为重要。
作为表面贴装组件,CL21X226MQQNNNE 可以通过标准的SMT(表面安装技术)工艺进行安装,这简化了生产流程并提高了生产效率。
CL21X226MQQNNNE 是一款高性能、紧凑且可靠的多层陶瓷电容器,广泛应用于各种电子设备中。其优异的技术规格、广泛的工作温度范围和小尺寸设计,使其成为设计工程师在选择通用电容器时的首选产品。无论是在消费电子、工业控制、汽车电子还是医疗设备领域,CL21X226MQQNNNE 都能提供出色的性能和可靠性。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products