WMSIC Electronic Components

CL21A225KAFNNNE

ModelCL21A225KAFNNNE
Package0805
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL21A225KAFNNNE
Type
SAMSUNG
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL21A225KAFNNNE
Electronic Component
1
Electronic Component
2.2uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0000001714
Electronic Component
X5R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CL21A225KAFNNNE - 三星贴片电容

CL21A225KAFNNNE是一款由三星(SAMSUNG)生产的高品质多层陶瓷电容器(MLCC),它具有出色的性能和可靠性,适用于各种电子应用。作为一种表面贴装(SMD)组件,这款电容器采用具有良好温度特性的X5R材料,能够在广泛的温度范围内稳定工作,满足现代电子电路的要求。

主要技术参数

  • 安装类型: CL21A225KAFNNNE为表面贴装类型,适合现代PCB(印刷电路板)设计。
  • 尺寸: 电容器的长宽分别为0.079英寸(2.00mm)和0.049英寸(1.25mm),厚度最大为0.053英寸(1.35mm)。这种小巧的尺寸使之非常适合空间受限的应用。
  • 电容值: 此电容器的标称电容为2.2µF,提供了良好的能量储存能力,适合各种滤波和耦合应用。
  • 额定电压: 该电容器的额定电压为25V,能够在多种电源电压下安全工作。
  • 温度范围: 工作温度范围为-55°C至85°C,能够适应严峻的环境条件。
  • 温度系数: X5R温度系数的选择使其具有适度的温度稳定性,适合大多数通用电子应用。
  • 容差: 产品容差为±10%,确保了在电路设计中能够提供一致的电容值。

应用场景

CL21A225KAFNNNE电容器广泛应用于各种电子设备中,包括但不限于:

  1. 消费电子: 如智能手机、平板电脑、电脑及其周边设备,提供电源旁路和耦合电路的功能。
  2. 工业设备: 在工控设备及测量仪器中,用于噪声过滤和信号耦合。
  3. 汽车电子: 适用于汽车控制单元和传感器,满足汽车电子对温度和可靠性的高要求。
  4. 家用电器: 在电视机、冰箱及其他智能设备中提高电源稳定性和降噪能力。

性能特点

  1. 高可靠性: 三星作为全球知名的电子元器件制造商,对产品品质严格把控,CL21A225KAFNNNE电容器在各种极端条件下也能保持稳定和可靠的性能。
  2. 低ESR和ESL: 该电容器具有较低的等效串联电阻(ESR)和等效串联电感(ESL),能够有效提高电路的高频响应,有助于提升信号完整性。
  3. 热稳定性好: X5R材料在温度变化时能够保持相对稳定的电容值,降低因温度变化引起的电容漂移风险。
  4. 便于自动化贴装: 表面贴装设计使得CL21A225KAFNNNE适合自动贴装工艺,提高生产效率。

Conclusion

综上所述,CL21A225KAFNNNE是一款性能优异、应用广泛的表面贴装多层陶瓷电容,凭借其小巧的尺寸、高稳定性的电容值和良好的温度性能,成为电子产品设计中的理想选择。选择CL21A225KAFNNNE,您将获得高品质的电子组件,帮助您的产品在竞争激烈的市场中脱颖而出。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.