WMSIC Electronic Components

CL31B105KCHNNNE

ModelCL31B105KCHNNNE
Package1206
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL31B105KCHNNNE
Type
SAMSUNG
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL31B105KCHNNNE
Electronic Component
1
Electronic Component
1uF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.074g
Electronic Component
1
Electronic Component
BM0000001234
Electronic Component
X7R
Voltage
100V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CL31B105KCHNNNE

一、引言

CL31B105KCHNNNE是一款由三星(SAMSUNG)生产的表面贴装多层陶瓷电容器(MLCC),其设计旨在满足各种电子应用的需求。这种电容器以其优良的性能和可靠性在现代电子电路中得到了广泛的应用。

二、基本参数

CL31B105KCHNNNE的基本参数如下:

  1. 电容值:1µF
  2. 额定电压:100V
  3. 容差:±10%
  4. 尺寸:1206封装(即3.20mm x 1.60mm)
  5. 厚度(最大值):0.071"(1.80mm)
  6. 温度系数:X7R
  7. 工作温度范围:-55°C ~ 125°C
  8. 安装类型:表面贴装(SMD)

三、性能特点

  1. 高电容密度:此型号电容器具备较高的电容密度,使得它在有限的空间内能够提供足够的电容量。
  2. 宽广的工作温度范围:能够承受从-55°C到125°C的工作环境,增强了其在严苛条件下的可靠性。
  3. 优越的稳定性:由于采用X7R温度系数,这款电容器在温度变化时能够保持较好的电容稳定性,适合用于需要精确电容值的电路中。
  4. 高电压容忍度:其高达100V的额定电压使得该电容器适用于高电压应用,降低了击穿风险。
  5. 小型化设计:采用1206封装,极大地节省了电路板的空间,适应现代电子产品对小型化的需求。

四、应用场景

CL31B105KCHNNNE电容器可广泛应用于多种电子设备中,包括但不限于:

  • 消费电子:如手机、平板电脑、笔记本电脑等小型设备,凭借其小巧的设计和高电容密度,能够为这些设备提供必要的电源滤波和耦合功能。
  • 工业设备:在自动化控制系统和设备中,提供稳定的电源,确保系统的高效与稳定。
  • 汽车电子:适合于电动汽车和现代汽车的各种电子控制单元(ECU),增强电气系统的稳定性。
  • 通讯设备:在基站和信号处理系统中,确保信号的质量,减少噪声干扰和电源不稳定引起的问题。

五、总结

CL31B105KCHNNNE作为一款高性能的多层陶瓷电容器,凭借其优越的电容特性、广泛的应用领域和良好的工作温度范围,成为众多电子制品设计中的理想选择。其出色的品质和稳定性能使得它在电子元器件市场中占据了重要位置。三星作为知名品牌,其生产的电容器在电子行业有着良好口碑,充分满足了设计工程师在不同应用中的严格需求。选用CL31B105KCHNNNE,不仅是追求电路性能的有效保障,也是现代电子设备中不可或缺的重要组成部分。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.