Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL10C150JB8NNNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10C150JB8NNNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10C150JB8NNNC
- Electronic Component
- 1
- Electronic Component
- 15pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0000001795
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL10C150JB8NNNC 贴片电容
在现代电子设备中，陶瓷多层电容（MLCC）因其优越的电气性能和便捷的表面贴装技术而广泛应用于各种电路中。三星（SAMSUNG）推出的 CL10C150JB8NNNC 贴片电容产品体现了这一技术的最新进展，提供了可靠且高效的解决方案，特别适用于对频率响应和稳定性有严格要求的电子电路。
基础参数
- 电容值：15pF
- 额定电压：50V
- 容差：±5%
- 温度系数：C0G（NP0）
- 工作温度范围：-55°C ~ 125°C
- 封装类型：0603（0.063" x 0.031" 或 1.60mm x 0.80mm）
- 厚度（最大值）：0.035"（0.90mm）
- 安装类型：表面贴装
产品描述
CL10C150JB8NNNC 是一款表面贴装、多层陶瓷电容，采用0603标准封装，适合高度集成和迷你化的电子产品设计。其具有15pF的电容值与50V的额定电压，使其在高频电路和信号处理应用中表现良好。C0G（NP0）温度系数特性保证了其在整个工作温度范围内（-55°C至125°C）保持良好的电气性能，确保低温漂移和优异的稳定性，因此尤其适合对温度敏感的应用。
应用领域
CL10C150JB8NNNC的应用场景极其广泛，涵盖了以下领域：
消费电子：如手机、平板电脑、笔记本电脑等，即使在高温环境下也能稳定工作，满足现代电子设备对组件小型化与高性能的需求。
通信设备：用于各种通信设备（如基站、路由器）中的滤波、电源耦合和耦合电路，提供稳定的工作性能。
医疗设备：由于其优秀的长期稳定性，适用于医疗仪器和设备，这些应用往往需要高可靠性和极小的温度变化。
工业控制：在工业自动化和控制系统中，使用此类电容可以提升系统的稳定性与抗干扰能力。
汽车电子：汽车仪器、车载通信系统等应用领域也非常适合该款电容，以满足日益增长的电气需求和耐环境变化的能力。
性能优势
CL10C150JB8NNNC凭借以下特点，在市场中独树一帜：
- 高可靠性：由于其材料和设计，能够在极端环境中工作，不易失效。
- 稳定性：C0G温度系数的设计确保在广泛的温度范围内有极低的电容变化，适合高精度应用。
- 小尺寸：0603封装尺寸小巧，便于在紧凑的电路板环境中实现高密度布局。
总结
总的来说，CL10C150JB8NNNC贴片电容是一款表现出色的高频应用电容件，以其15pF的电容值、50V的额定电压、以及优异的C0G（NP0）特性，使其在众多高科技行业中都能发挥重要作用。无论是在消费电子、通信领域，还是在医疗和汽车工业中，该电容都能以其卓越的性能来满足严苛的电路设计需求，是值得信赖的电子元器件选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
