Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SAMSUNG CL05A225MQ5NSNC是一款高性能的多层陶瓷电容(MLCC),其额定电压为6.3V,电容量为2.2µF,具有±20%的容差。这款电容采用了X5R温度系数,适用的工作温度范围广泛,从-55°C到85°C,能够在多种环境下稳定工作。它的封装类型为0402(或称1005公制),尺寸为1.00mm x 0.50mm,厚度最大为0.55mm,因而适合空间受限的小型电子设备中使用。
多层陶瓷电容由多个陶瓷层和金属电极叠加而成,通过烧结工艺形成,内部的陶瓷材料通常选择高介电常数的钛酸钡(BaTiO₃)。这一设计使得MLCC能够实现高电容密度和较小的体积。X5R温度系数的电容器在温度变化下表现得相对稳定,其介电常数在-55°C至85°C范围内的变化较小,适合需要稳定电容量的应用场合。
高电容密度:2.2µF的储能能力与0402封装的紧凑设计相结合,使其在体积小的前提下提供了相对较大的电容量,非常适合移动设备等紧凑型产品的需求。
稳定性:X5R温度系数确保电容在极广的温度范围内保持良好的电性能,适用于需经常经历温度波动的电子设备。
高可靠性:由于采用陶瓷材料,CL05A225MQ5NSNC在高湿、高温及化学腐蚀性环境中表现出色,旨在提高元器件的使用寿命和可靠性。
适应性:广泛应用于各类电子产品中,特别是对电源去耦、滤波及缓冲电路设计等领域,均展现出良好的性能,尤其在通信、消费电子、汽车电子与工业计算机等领域具备强大的适应性。
SAMSUNG CL05A225MQ5NSNC由于其多样的特性和出色的性能,在多个领域得到了广泛的应用:
优势:
劣势:
SAMSUNG CL05A225MQ5NSNC是一款功能强劲、性能可靠的MLCC电容器,凭借其极佳的电气特性、稳定性及广泛的应用场景,成为现代电子设备中不可或缺的基础元件之一。无论是在消费电子、汽车电子还是工业领域,其表现都证明了其在高要求环境中的可靠性和适用性。随着技术的不断进步与市场需求的日益多样化,CL05A225MQ5NSNC将持续扮演重要角色。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products