WMSIC Electronic Components

CL32A107MQVNNNE

ModelCL32A107MQVNNNE
Package1210
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL32A107MQVNNNE
Type
SAMSUNG
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL32A107MQVNNNE
Electronic Component
1
Electronic Component
100uF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.162g
Electronic Component
1
Electronic Component
BM0264074231
Electronic Component
X5R
Voltage
6.3V
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CL32A107MQVNNNE

CL32A107MQVNNNE是由三星(SAMSUNG)制造的一款多层陶瓷电容器(MLCC),其设计与规格使其成为现代电子设备中广泛应用的通用元件。该电容器以其高性能特性和可靠的电压支持,在各种电路设计和应用中发挥着重要作用。

基础参数与规格

  1. 安装类型: CL32A107MQVNNNE采用表面贴装(SMD)方式,便于在自动化生产中快速、高效地进行组装。这种类型的安装不仅节省了电路板空间,也使得电子设备更轻更小。

  2. 电容量: 该电容器的电容量为100µF,能够存储较大电量,适用于直流电源滤波、信号旁路和能源存储等多种应用。

  3. 额定电压: 它的额定电压为6.3V,确保在受控的电流和电压范围内安全运行,适合低电压应用的需求。

  4. 容差: CL32A107MQVNNNE的容差为±20%,这意味着实际电容量可能在80µF至120µF之间,适合一般的电子元器件应用。

  5. 尺寸与封装: 尺寸为0.126" x 0.098"(3.20mm x 2.50mm),符合1210封装(3225公制)的标准,适合多种电路板布局设计。

  6. 工作温度范围: 该电容器能够在-55°C到85°C的温度范围内稳定工作,适应各种环境条件,适合工业、汽车及消费电子等领域。

  7. 温度系数: CL32A107MQVNNNE具有X5R温度特性,这使得它在温度变动下能保持良好的电容量稳定性,适合需要频繁温度变化的应用场景。

  8. 厚度(最大值): 最大厚度为0.110"(2.80mm),在设计紧凑的电路板中并不会占用过多的空间。

应用场景

CL32A107MQVNNNE电容器广泛应用于多个电子设备中,主要包括:

  • 消费电子: 适用于如手机、平板电脑、智能手表等设备,负责电源管理、信号过滤和旁路应用,保证设备稳定运行。

  • 工业设备: 在工业自动化和控制系统中,它能够用于电源线的去耦和噪声抑制,提升设备的整体性能和可靠性。

  • 汽车电子: 由于其优越的温度特性和可靠性,CL32A107MQVNNNE也被广泛应用于汽车电子设备,如导航系统、传感器和车载娱乐系统。

  • 通讯设备: 在无线通讯和网络设备中,稳定的电源供给和信号传递至关重要,CL32A107MQVNNNE电容器可降低电源噪声,确保数据的快速和稳定传输。

性能与优势

CL32A107MQVNNNE多层陶瓷电容器在诸多方面展示出了其显著的性能优势,例如:

  • 高可靠性: 作为MLCC,具备优良的温度特性和稳定性,在苛刻的环境下仍能稳定工作。

  • 小型化设计: 其紧凑的封装和小尺寸使得设计师在制作电路板时能够节省空间,并在设计中融入更多功能。

  • 高效能: 其极低的等效串联电阻(ESR)和等效串联电感(ESL)特性,改善了电源过滤效果及信号完整性。

总之,CL32A107MQVNNNE多层陶瓷电容器凭借其卓越的电气性能、优越的温度特性和小型化设计,广泛应用于各类电子产品中,满足了现代电子设计对性能和空间的双重需求,是一款值得信赖的电子元件选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.