Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL21A226KPCLRNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL21A226KPCLRNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL21A226KPCLRNC
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0017939861
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL21A226KPCLRNC 贴片电容 (MLCC)
一、产品基本信息
CL21A226KPCLRNC 是一款由三星（SAMSUNG）制造的多层陶瓷电容（MLCC）。该产品广泛应用于各类电子设备，特别是在空间受限的应用场景中，由于其小尺寸和高容量而备受青睐。其基本参数如下：
- 类型：表面贴装（SMD）陶瓷电容
- 电容值：22µF
- 额定电压：10V
- 容差：±10%
- 温度特性：X5R
- 封装规格：0805（2.00mm x 1.25mm）
- 工作温度范围：-55°C ~ 85°C
- 厚度：最大0.037"（0.95mm）
二、产品特性与优势
小尺寸设计： CL21A226KPCLRNC 的0805封装（2012公制）设计，使其在电路中占用极小的空间。这对于现代电子设备尤为重要，尤其是在手机、平板电脑、智能穿戴设备及其他对空间要求严格的应用中，能够有效提升设计的灵活性和产品的紧凑性。
高容量与低电压特性： 该电容的22µF容量在其尺寸范围内划分较高，使其能够提供足够的能量存储，满足多种电源解耦、滤波及旁路应用的需求。额定电压为10V，适合在大多数常规电子应用中使用。
温度稳定性： X5R温度特性意味着该电容在-55℃到+85℃的工作环境下能够保持良好的电容值及性能。在许多行业中（如汽车电子、消费电子等），此类温度稳定性是必需的，确保电容在复杂温度条件下的可靠运行。
高可靠性与长期稳定性： 多层陶瓷电容设计及高品质的制造工艺保证了该电容在长时间工作中的稳定性。相较于其他类型的电容，MLCC通常具备更低的自放电率和更高的可靠性，适合对元器件寿命有高要求的应用。
三、应用领域
CL21A226KPCLRNC 适用于多种电子设备和电路，包括但不限于：
- 消费电子：如电视、笔记本电脑、智能手机和平板电脑等，作为电源去耦和滤波电容。
- 工业设备：用于电源模块、仪器仪表等，提高电路的稳定性。
- 汽车电子：在汽车音响系统、导航设备等需要高可靠性的电子元器件中应用广泛。
- 开关电源：用于平滑输出波形和减少电源噪声，提高设备性能。
- 通信设备：如路由器、交换机等通信设备，保证信号传输的稳定性。
四、使用建议
在使用 CL21A226KPCLRNC 贴片电容时，设计师应注意以下几点：
- 工作电压：务必确保操作电压不超过额定值，10V为最大值，实际使用时建议留有余量以提升可靠性。
- PCB布局：由于其表面贴装特性，PCB设计时应考虑良好的焊盘设计和布局，确保焊接效果及电气性能。
- 环境条件：虽然该电容具有优良的温度特性，但在极端环境下使用时仍需考虑外部影响因素对电容的性能。
五、总结
CL21A226KPCLRNC 是一款高性能的小型贴片陶瓷电容，凭借其优越的电性能与可靠性，广泛应用于现代电子设备中。在设计时，充分考虑其特性和应用场景，将极大提升项目的成功率。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
