WMSIC Electronic Components

CL32B475KBJVPNE

ModelCL32B475KBJVPNE
Package1210
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL32B475KBJVPNE
Type
SAMSUNG
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL32B475KBJVPNE
Electronic Component
1
Electronic Component
4.7uF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.162g
Electronic Component
1
Electronic Component
BM0264355826
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

三星CL32B475KBJVPNE 多层陶瓷贴片电容(MLCC)产品概述

一、产品基本定位

CL32B475KBJVPNE是三星电子推出的通用型多层陶瓷贴片电容(MLCC),属于三星CL系列高可靠性产品线。该产品针对电子电路中滤波、耦合、旁路等基础功能设计,兼顾容值稳定性、耐压能力与宽温适应性,是消费电子、工业控制、通信设备等领域的常用选型,可替代同类品牌同参数产品。

二、核心性能参数详解

该型号核心参数围绕四大维度展开,精准匹配通用电路需求:

  1. 容值与精度:标称容值为4.7μF(型号中“475”为容值代码,即475×10³pF),精度为**±10%**,满足90%以上通用电路对容值偏差的要求;
  2. 额定电压:直流额定电压为50V,实际使用需遵循80%降额原则(长期工作电压≤40V),可有效避免容值衰减与寿命缩短;
  3. 温度特性:采用X7R介电材料,温度范围覆盖**-55℃至+125℃**,此范围内容值变化≤±15%,相比Y5V等低压高容材料,稳定性提升显著;
  4. 损耗与频率:典型损耗角正切(tanδ)≤2.5%(1kHz/25℃条件下),谐振频率约为10MHz,适合中低频信号通路的低损耗应用。

三、封装与尺寸规格

CL32B475KBJVPNE采用1210封装(英制命名,对应公制3225,即长3.2mm、宽2.5mm),具体尺寸参数如下:

  • 长:3.2±0.2mm;
  • 宽:2.5±0.2mm;
  • 厚度:1.0±0.1mm(典型值,部分批次为1.2mm,需参考官方 datasheet);
  • 焊盘适配:兼容标准SMT焊盘设计,支持回流焊(峰值260℃/10s)、波峰焊(需顶部保护)工艺。

该封装平衡了容值密度与PCB空间占用,适合对尺寸敏感但需中等容值的电路设计。

四、典型应用场景

结合参数特性,该产品主要适用于以下场景:

  1. 消费电子:智能手机、平板电脑的电源滤波(如电池管理系统BMS输入/输出滤波)、音频电路耦合;
  2. 工业控制:PLC、变频器的模拟信号滤波、数字电源去耦,宽温X7R材料适配工业环境(-40℃至+85℃常见);
  3. 通信设备:路由器、交换机、基站的电源模块滤波、射频信号旁路,容值稳定可保证信号传输质量;
  4. 小型医疗设备:便携式血糖仪、血压计的信号调理电路,符合RoHS环保要求满足医疗设备合规性。

五、品牌可靠性与合规性

三星作为全球MLCC核心供应商,该产品具备以下可靠性优势:

  1. 工艺成熟:采用多层陶瓷叠层工艺,容值一致性好,批次偏差控制在±5%以内(远超行业标准);
  2. 环境适应性:耐焊接热符合J-STD-020标准,抗弯折性符合IEC 60068-2-21标准(弯曲半径10mm);
  3. 环保合规:符合欧盟RoHS 2.0、REACH法规,无铅无卤,满足全球市场环保要求;
  4. 寿命保障:额定条件下平均无故障时间(MTBF)达百万小时级别,长期可靠性稳定。

六、选型参考与注意事项

  1. 精度升级:若需±5%高精度,可选择三星CL32B475KBP系列(后缀差异体现精度等级);
  2. 高温场景:环境温度超过125℃时,需切换至X8R/X9R高温系列;
  3. 高频应用:1210封装寄生电感约1nH,高频电路(>100MHz)建议选0603/0402小封装;
  4. 电压降额:严禁长期工作电压超过40V,避免过压导致容值不可逆衰减。

该产品凭借三星的工艺优势与参数适配性,成为通用电子领域的高性价比选型,可满足大多数中低端电路的基础功能需求。

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