Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL10A226MQ8NRNC
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10A226MQ8NRNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10A226MQ8NRNC
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.047g
- Electronic Component
- 1
- Electronic Component
- BM0000001237
- Electronic Component
- X5R
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SAMSUNG CL10A226MQ8NRNC 贴片电容 (MLCC)
一、产品简介
CL10A226MQ8NRNC 是由三星（SAMSUNG）公司生产的一款高性能多层陶瓷电容器（MLCC），其电容值为22µF，额定电压为6.3V，采用0603封装（即长1.60mm x 宽0.80mm），具备行业标准尺寸，适合于多种表面贴装应用。此款电容具有良好的温度稳定性，电容类型为X5R，能够有效地满足广泛的电子设备需求。
二、技术参数
- 厚度: 最大厚度为0.039"（1.00mm），适应多层电路板设计。
- 电容值: 22µF，提供稳定的电流和电压输出，适合各种电源和信号去耦应用。
- 额定电压: 6.3V，确保在规定的电压范围内安全运行。
- 温度系数: X5R，具备中等的温度变化特性，适合于-55°C至85°C的工作环境。
- 容差: ±20%，提供可靠性和稳定性，适合用于一般用途。
- 封装类型: 0603，符合广泛使用的表面贴装技术（SMT），便于自动化贴装。
三、应用领域
CL10A226MQ8NRNC 贴片电容的应用场景非常广泛，主要包括：
- 电源去耦: 在电力电子设备中，6726可有效消除电源噪声，提高电路稳定性。
- 滤波电路: 用于高频信号的平滑处理，减少信号的干扰和失真。
- 耦合和去耦应用: 在音频设备和射频电路中，帮助耦合和去耦信号。
- 通信设备: 适用于各种通信设备和移动终端，提升设备的整体性能。
- 消费电子产品: 适合使用于智能手机、平板电脑、家用电器等多个消费电子领域。
四、优点与特点
- 高度可靠: X5R电容具有较好的绝缘性能和可靠性，长久使用不会出现显著的衰减。
- 小尺寸: 0603的封装设计非常小巧，适合空间受限的应用场合。
- 宽温范围: 可在-55°C至85°C的环境中稳定工作，适合于多种严苛环境下的应用需求。
- 表面贴装设计: 大大减少了设备的生产成本和组装难度，适合现代电子产品小型化和高密度组装趋势。
五、总结
SAMSUNG CL10A226MQ8NRNC 贴片电容是一款性能稳定的多层陶瓷电容，适用于多种电子产品和信号处理应用，其额定电压为6.3V，具有22µF的电容量，特别适合对空间和电气性能要求较高的设备。作为一个集高可靠性和优异性能于一体的元器件，CL10A226MQ8NRNC 是电子工程师在设计高性能电路时的重要选择。无论是在消费电子、工业设备还是通信领域，这款电容都能为您的产品提供有力的支持和保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
