WMSIC Electronic Components

CL10B105KO8NNNC

ModelCL10B105KO8NNNC
Package0603
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL10B105KO8NNNC
Type
0603
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL10B105KO8NNNC
Electronic Component
1
Electronic Component
1uF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM69413949
Electronic Component
X7R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CL10B105KO8NNNC - 三星(SAMSUNG)贴片电容

CL10B105KO8NNNC 是三星(SAMSUNG)推出的一款高性能贴片电容,属于多层陶瓷电容(MLCC)系列,广泛应用于现代电子设备中。这款电容以其优越的电气性能和可靠性,适合各种通用电子应用。

1. 基础参数

  • 安装类型: 表面贴装 (SMD)
  • 电压 - 额定: 16V
  • 应用: 通用
  • 电容值: 1µF
  • 厚度 (最大值): 0.035"(0.90mm)
  • 工作温度范围: -55°C ~ 125°C
  • 封装规格: 0603 (1.60mm x 0.80mm)
  • 温度系数: X7R
  • 电容容差: ±10%

2. 设计与封装

CL10B105KO8NNNC 的0603封装设计使其在紧凑的空间中仍能提供稳定的电性能。这种小型化设计非常适合现代电子设备日益缩小的体积需求,如便携式电子产品和消费类电子。此外,支持表面贴装工艺(SMD),确保了更高的生产效率和更低的装置成本。

3. 工作性能

此贴片电容的额定电压为16V,为许多电路应用提供了足够的安全裕度。1µF的电容值使其特别适用于电源去耦、滤波和信号耦合等应用,能够有效平滑电压波动并降低电源噪声。其 X7R 温度系数在各种温度变化条件下能够保持稳定的电容值,适用于所需的宽温工作环境(-55°C ~ 125°C)。

4. 应用领域

CL10B105KO8NNNC 贴片电容广泛应用于多个电子产品领域,包括但不限于:

  • 消费类电子: 如智能手机、平板电脑及其他移动设备,使用此电容可提升设备内置的电源性能,有效阻止电压尖峰。
  • 工业设备: 在工控系统中,它能提高控制电路的稳定性和抗干扰能力。
  • 汽车电子: 随着汽车电子设备的普及,这款电容能够应对汽车工作环境下的极端温度变化和电气性能要求。
  • 通信设备: 在高速通信设备中,MLCC的低ESR(等效串联电阻)和低ESL(等效串联电感)特性帮助提高信号质量。

5. 总结

CL10B105KO8NNNC 是一款结构紧凑、性能优越的高可靠性贴片电容,凭借其多种应用优势和出色的电气性能,在当今电子制造领域中占据了重要地位。选择三星的这款电容,能够确保设计方案满足严苛的规格要求,并提升最终产品的竞争力。

总之,CL10B105KO8NNNC 是一款兼具性能与质量的MLCC电容类产品,适合广泛的电子应用,满足您对电源管理和信号处理的各种需求。通过合理的应用,在提升产品的稳定性和可靠性方面,发挥其重要作用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.