WMSIC Electronic Components

CL32B476KPJNNNE

ModelCL32B476KPJNNNE
Package1210
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL32B476KPJNNNE
Type
SAMSUNG
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL32B476KPJNNNE
Electronic Component
1
Electronic Component
47uF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.161g
Electronic Component
1
Electronic Component
BM0265843514
Electronic Component
X7R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

三星CL32B476KPJNNNE多层陶瓷电容器(MLCC)产品概述

一、产品定位与核心属性

三星CL32B476KPJNNNE是一款表面贴装通用型多层陶瓷电容器(MLCC),隶属于三星电子被动元件产品线,针对中低电压、常规容值需求的电子电路设计,兼顾体积小型化与性能稳定性,适用于消费电子、小型工业设备等多领域,是替代传统插件电容的高性价比选择。

二、关键参数详解

该产品核心参数明确,可支撑大多数常规电路的滤波、耦合等功能:

  1. 容值与精度:标称容值47μF(对应代码“476”,即47×10⁶ pF),精度±10%,满足非高精度电路的容值需求,无需额外匹配高精度元件;
  2. 额定电压:10V DC(直流额定电压),适配3.3V、5V等低电压供电系统,避免过压风险;
  3. 温度系数(介质类型):X7R介质,温度范围覆盖**-55℃至+125℃**,容值变化率控制在±15%以内——相比Y5V等低稳定介质,X7R在宽温环境下的容值波动更小,可适配户外或高低温交替场景;
  4. 封装尺寸:1210(英制封装代码,对应公制3225,即3.2mm×2.5mm),属于小型化SMD封装,适配高密度PCB设计。

三、封装与物理特性

作为SMD/SMT型元件,CL32B476KPJNNNE采用多层陶瓷叠层结构,端电极采用三星专利的Ni/Cu/Sn三层结构,确保:

  • 焊接可靠性:适配回流焊、波峰焊等自动化贴装工艺,焊点强度符合IEC 60068-2-20等行业标准,长期使用无虚焊风险;
  • 体积紧凑:1210封装在保证47μF容值的前提下,比同容值插件电容体积缩小80%以上,满足智能手机、无线耳机等便携式设备的小型化需求;
  • 无极性设计:无需区分正负极,安装便捷,降低生产环节的出错率。

四、典型应用场景

因参数适配性强,该产品广泛应用于以下领域:

  1. 消费电子终端:智能手机、平板电脑的电源管理模块(PMIC)滤波、音频电路耦合;无线耳机的充电电路旁路电容;
  2. 小型家电与智能设备:智能家居遥控器、智能灯泡、小型加湿器的控制板滤波;
  3. 低电压工业控制:小型PLC(可编程逻辑控制器)的输入输出电路、传感器模块的信号耦合;
  4. 车载辅助电路:车载信息娱乐系统的低电压部分(如USB充电口、显示屏背光电路)滤波。

五、产品优势与价值

三星作为全球被动元件龙头,CL32B476KPJNNNE体现出以下核心优势:

  1. 可靠性与一致性:三星严格的生产工艺管控(如叠层精度±0.5μm、烧结温度控制在1300℃±10℃),确保批量产品容值、耐压的一致性,降低电路设计风险;
  2. 宽温稳定性:X7R介质的宽温特性,避免了低温下容值下降、高温下性能衰减的问题,适合复杂环境应用;
  3. 性价比突出:作为通用型MLCC,在保证性能的前提下,成本远低于高精度(±1%)、高电压(≥25V)MLCC,适合大规模量产需求;
  4. 环保兼容性:端电极采用无铅工艺,符合RoHS 2.0、REACH等环保标准,适配全球市场准入要求。

六、选型与使用注意事项

为保证电路性能与产品寿命,需注意以下要点:

  1. 电压降额:实际工作电压建议不超过额定电压的80%(即≤8V),避免长期直流偏置导致容值衰减(X7R介质在10V偏置下容值约降5%-10%);
  2. 温度限制:使用环境温度需控制在-55℃至+125℃范围内,超过上限可能导致介质老化、容值快速下降;
  3. 焊接工艺:回流焊温度曲线需符合三星推荐标准(如峰值温度240℃以内,时间≤10秒),避免热应力造成电容开裂;
  4. 容值验证:若电路对容值精度要求较高,建议在实际工作电压(如5V)、温度(如25℃)下测试容值,确保满足设计需求。

该产品凭借三星的品牌背书与稳定性能,成为中低电压通用电路的主流选型之一,可有效降低电路设计复杂度与成本。

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