Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL32B106KBJNNNE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL32B106KBJNNNE
- Type
- SAMSUNG
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL32B106KBJNNNE
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 1210
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.162g
- Electronic Component
- 1
- Electronic Component
- BM69413962
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SAMSUNG CL32B106KBJNNNE 产品概述
概述
SAMSUNG CL32B106KBJNNNE 是一款高性能的多层陶瓷电容器（MLCC），其主要参数包括电容量10µF、额定电压50V和±10%的容差。这款电容器采用X7R温度系数材料，能够在广泛的温度范围内稳定工作，冲击和振动条件下具有优良的性能。这些特性使得CL32B106KBJNNNE成为多种电子设备应用的理想选择，尤其适用于消费电子、通信设备和工业控制系统等领域。
主要参数
- 电容量: 10µF，提供了良好的储能性能，适合于各种滤波、耦合和去耦应用。
- 容差: ±10%，使得该电容器可以在不同的工作条件下提供可靠的性能。
- 额定电压: 50V，适合大多数中等电压应用。
- 温度系数: X7R，此种陶瓷电容器的电容值在-55°C到125°C的温度范围内具有良好的稳定性，适合在温度变化较大的应用场合。
- 工作温度: -55°C ~ 125°C，显示了该电容器在极端环境条件下的适应能力。
安装类型
此电容器的安装方式为表面贴装（SMD），采用1210（3225公制）封装。1210封装尺寸为0.126"长 x 0.098"宽（3.20mm x 2.50mm），厚度最大值为0.106"（2.70mm），这种小型化的设计使其在PCB板上占用更少的空间，从而提高了设备的集成度和工作效率。
应用领域
CL32B106KBJNNNE广泛应用于以下领域：
- 消费电子: 在智能手机、平板电脑和其他便携式设备中，用于去耦和滤波，以稳定电源和保持信号完整性。
- 通信设备: 在基站和路由器中，提供电源管理和信号处理，确保高质量的数据传输。
- 工业控制: 在工业自动化设备和控制系统中，作为滤波器和耦合电容器使用，提高系统的稳定性和可靠性。
性能优势
SAMSUNG CL32B106KBJNNNE电容器具有以下优势：
- 优良的温度稳定性: X7R材质确保电容值在各种环境条件下保持稳定，适合用于需求高稳定性的电子产品。
- 高能量密度: 在相同的封装尺寸下，相较于铝电解电容器，陶瓷电容器的能量密度更高，能够在较小的体积内提供较大的电容量。
- 低ESR和EPD: 低等效串联电阻（ESR）和等效串联电感（ESL）特性使其拥有更高的频率响应能力，对于高频应用尤为重要。
结论
SAMSUNG CL32B106KBJNNNE是一款具有出色性能与可靠性的表面贴装多层陶瓷电容器。其适用范围广泛且在热稳定性和电气特性上表现突出，是各类电子设备中不可或缺的元件。无论是在要求严格的工业应用还是在高频率的消费电子产品中，CL32B106KBJNNNE都能为设计工程师提供一个稳健的解决方案，有助于提高系统的整体性能和可靠性。选择CL32B106KBJNNNE，您将获得三星品牌的质量保证与强大的技术支持，是确保您电子设计成功的明智之选。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
