Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL21B225KAFNNNE 是一款性能优越且适用范围广泛的多层陶瓷电容器(MLCC),由知名电子元器件制造商三星(SAMSUNG)生产。这款电容的主要特点包括其额定电压、容量、温度系数及包装规格,使其在各种电子应用中成为理想的选择。
CL21B225KAFNNNE 的电容值为 2.2µF,提供了良好的去耦、滤波以及耦合功能。±10%的容差使其在实际应用中具有相对较高的精度,能够满足大多数电子电路的需求。其额定电压为 25V,可以适应多种工作条件,特别是在低电压应用中表现尤为出色。
与其他类型的电容相比,多层陶瓷电容器(MLCC)在频率特性及稳定性方面都具有明显优势。X7R 是一种常用的温度特性,其工作温度范围宽,从 -55°C 到 125°C,适合在多样化的环境中使用。无论是在工业、汽车还是消费电子领域,该电容器都能够稳定运行。
CL21B225KAFNNNE 采用 0805 封装,具有较小的尺寸(2.00mm x 1.25mm),适合现代电路设计对空间的严格要求。表面贴装技术(SMD)使得该电容器易于集成进各种电路板,为高密度电路提供了更大的灵活性。
由于其小巧的外形和卓越的性能,CL21B225KAFNNNE 特别适合于高频应用,如射频模块、数字电路及电源管理电路等。在手机、平板电脑、音响设备等消费电子产品中,这款电容器同样可以发挥重要作用。
CL21B225KAFNNNE 的应用场景十分广泛,涵盖:
总的来说,CL21B225KAFNNNE 是一款在小型化、高稳定性和宽工作温度范围等方面表现出色的多层陶瓷电容器。它不仅能够满足现代电子产品对高性能、小体积的需求,而且在各类应用中也展现了良好的适应性。无论是设计新的电子产品,还是对现有系统进行升级,CL21B225KAFNNNE 都是值得考虑的理想选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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