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CL21B106KAYQNNE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL21B106KAYQNNE
- Type
- SAMSUNG
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL21B106KAYQNNE
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.045g
- Electronic Component
- 1
- Electronic Component
- BM0230090539
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL21B106KAYQNNE 产品概述
一、产品简介
CL21B106KAYQNNE 为 SAMSUNG（三星）生产的一款多层陶瓷贴片电容（MLCC），尺寸为 0805（公制 2012），标称容量 10 μF，公差 ±10%，额定电压 25 V，介质类型 X7R。属于中低压、较大容量的片式电容，适合储能、去耦与旁路等场合。
二、主要参数
- 容值：10 μF
- 精度：±10%（K）
- 额定电压：25 V
- 介质：X7R（工作温度范围典型为 −55°C 至 +125°C）
- 封装：0805（2012）SMD
- 品牌：SAMSUNG
三、性能与特点
- X7R 介质提供在宽温区间的稳定性，适合一般工业与消费类产品使用。
- 0805 封装在尺寸与容量之间取得平衡，便于自动贴装与高速回流焊工艺。
- 相较于薄膜或电解电容，MLCC 响应速度快、等效串联电阻（ESR）低，适合去耦和高频旁路。
- 需注意 DC bias 与温度对容值的影响：在高直流偏压下实际容值会下降，实际电路设计应参考厂方 DC-bias 曲线。
四、典型应用
- 电源去耦与旁路（DC-DC 输出、LDO 输入/输出）
- 滤波与储能（音频、通信模块）
- 移动设备、消费电子、工业控制与汽车电子（视认证等级而定）
五、设计与使用建议
- 对于关键滤波或储能场合，应查阅厂方 DC-bias 与温度特性曲线并留有裕量（建议额定电压留余 2–3 倍视应用）。
- 采用推荐焊盘及回流曲线，避免过度热应力和机械应力导致裂片。
- 储存和贴装时注意防潮与静电防护，回流后避免过度弯曲或剪切力。
六、质量与可靠性
- MLCC 一般具有较高可靠性，但受振动、热循环及焊接工艺影响。批量设计时建议进行实物测试（热循环、机械冲击、寿命验证）。
- 如用于声光或安全类关键系统，请与供应商确认寿命与汽车级认证（若需）。
七、包装与采购
- 常见为卷带包装（V-reel），适用于自动贴装。订购时请确认包装单元、批次及所需认证文档。
如需厂方完整规格书（datasheet）或 DC-bias/温度特性曲线，我可帮您检索并对比同类替代型号。
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