WMSIC Electronic Components

CL05C150JB5NNNC

ModelCL05C150JB5NNNC
Package0402
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL05C150JB5NNNC
Type
SAMSUNG
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL05C150JB5NNNC
Electronic Component
1
Electronic Component
15pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.013g
Electronic Component
1
Electronic Component
BM0265062325
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CL05C150JB5NNNC 贴片电容 (MLCC)

一、产品基本信息

CL05C150JB5NNNC 是三星(SAMSUNG)公司推出的一款高性能多层陶瓷电容(MLCC),它采用了先进的表面贴装技术,具有小巧的0402封装(1005公制)规格,适用于各种现代电子设备的设计需求。该电容的额定电压为50V,电容值为15pF,容差为±5%。其工作温度范围广泛,能够在-55°C至125°C的恶劣环境下稳定工作。

二、基础参数

  • 安装类型:表面贴装(SMD)
  • 封装尺寸:0402(长1.00mm x 宽0.50mm)
  • 厚度:最大0.022"(0.55mm)
  • 电容:15pF
  • 额定电压:50V
  • 温度系数:C0G(NP0)
  • 工作温度范围:-55°C至125°C
  • 容差:±5%

三、技术特点

  1. 温度稳定性:C0G(NP0)温度系数确保电容在不同温度下的电容值稳定性极佳,适合用于高频和高温环境,对电路性能影响极小。

  2. 小型化设计:0402的封装形式使得这款电容在电路板上占用的空间极小,适合高密度集成电路的设计,满足现代电子产品对小型化和轻量化的需求。

  3. 高可靠性:三星作为知名的电子元器件制造商,其产品经过严格的质量测试,具有良好的长时间稳定性和高可靠性,确保在多种应用场景下的出色表现。

四、应用场景

CL05C150JB5NNNC 贴片电容广泛应用于消费电子、通信设备、汽车电子、医疗设备以及其他需要小型高性能电容的电子产品中。它尤其适合在以下领域中使用:

  • 射频电路:适合于RF信号路径中的耦合、去耦和偏置应用,能有效降低噪声干扰。
  • 信号处理:在各种信号处理电路中,该电容能提供优秀的频率响应,确保信号质量。
  • 电源管理:在电源管理芯片中提供去耦和滤波功能,保障电源的稳定性和可靠性。
  • 汽车电子:用于各种汽车电子控制模块中,满足汽车电子设备对高温和高强度环境的要求。

五、购买与认证

CL05C150JB5NNNC的生产与销售符合国际标准,用户在采购时可以查询相关认证信息(如RoHS、REACH等),确保其符合环保和安全标准。

六、总结

三星的CL05C150JB5NNNC贴片电容以其出色的电气特性和可靠品质,成为电子设计工程师在构建现代高效电路时的理想选择。无论是个人项目还是大规模的产品开发,其稳定的性能和小巧的封装特性都必将为您的设计提供强有力的支持。通过合理选择与应用,充分发挥其技术优势,必将提升您的产品竞争力。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.