Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL10B475KQ8NQNC 是一款由三星(SAMSUNG)生产的多层陶瓷电容器(MLCC),具有广泛的应用场景,适合用于各种电子设备的电气稳定与滤波。它的基本参数使其成为高性能、可靠性的电子元器件,能够在严苛的环境下继续稳定工作。
CL10B475KQ8NQNC 电容器的工作温度范围广泛,从-55°C 到 125°C,适用于各种温度变化大的环境,例如汽车电子、工业控制和消费者电子产品。此型号的电容器可在较为严酷的环境条件下保持稳定的性能,并具有较低的电容漂移,从而充分满足高可靠性电路的需求。
该电容器的额定电压为6.3V,适用于多种低压应用。在实际使用中,电容值为4.7µF,能够支持电路的平稳运行,同时也在一定的频率下表现出良好的滤波特性。此外,±10%的容差保证了在应用中电容值的灵活性,满足各种设计需求。
CL10B475KQ8NQNC 的设计为0603封装,尺寸小巧,便于在高密度电路板上进行表面贴装(SMD)。其小巧的体积使得该电容器尤其适合于智能手机、平板电脑、家电、LED照明和物联网设备等对空间有限要求的应用。
温度系数 X7R 是一个非常受欢迎的材质选择,因其在整个温度范围内的良好稳定性。对于需要相对恒定电容值的应用,如滤波、耦合和旁路,X7R 温度系数能够有效支持其性能,确保电容在不同条件下的可靠工作。
采用多层陶瓷材料的 CL10B475KQ8NQNC 产品具备强大的抗电压击穿特性、较低的电阻和出色的频率响应,提升了其在复杂电路中的适应性。同时,多层结构设计使其在物理抗冲击性能方面优于传统电容器,满足对耐用性有高要求的应用。
CL10B475KQ8NQNC 的应用范围非常广泛,能够在锂电池供电的移动设备、医疗仪器、汽车电子、工业自动化、消费性电子产品等领域中发挥至关重要的作用。在这些领域,电容的性能稳定性直接影响到整个电路的功能和安全性。
CL10B475KQ8NQNC 作为一款性能优越的多层陶瓷电容器,凭借其卓越的电性能、高可靠性和小巧的体积,已成为设计师和工程师在开发和制造电子产品时的优选元件。随着科技的进步和对高性能电子产品需求的不断增长,CL10B475KQ8NQNC 将继续展现其在各类应用中的重要性和适应性。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products