Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL10B153KB8NNNC 是一款由三星(SAMSUNG)制造的多层陶瓷电容器(MLCC),具备表面贴装(SMD)特点,适用于各种通用电路和电子设备。这款贴片电容的额定电压为50V,电容值为15nF(即0.015µF),具有±10%的容差,能够在广泛的温度范围内稳定工作。
高频特性: 作为一种MLCC,CL10B153KB8NNNC在高频信号条件下表现出很好的特性,非常适合用于高频和射频应用,是现代电子设备中不可或缺的基础元件。
良好的电压特性: 此电容器的额定电压为50V,能够满足大多数通用电路的需求,为电路提供更高的稳定性和安全性。
高温稳定性: 该电容器的工作温度范围广,从-55°C至125°C,这使其非常适合用于严苛环境下的应用。
紧凑设计: 尺寸为0603(1.60mm x 0.80mm),厚度仅为0.035"(0.90mm),使其适用于空间有限的电路设计。
负载寿命: 采用X7R的温度系数,能够在较宽的温度范围内维持电容的稳定性,减小因温度变化带来的电容值变化。
CL10B153KB8NNNC广泛应用于各种电子产品中,包括但不限于:
CL10B153KB8NNNC是一款高性能的多层陶瓷电容,因其卓越的电气特性、宽温工作范围及紧凑的封装设计,使其成为现代电子产品中不可或缺的基础元件。无论在高速信号处理还是电源滤波方面,CL10B153KB8NNNC均表现优异,是设计师和工程师在选择电容器时的极佳选择。对于追求高可靠性和高性能的电子项目,三星的这款贴片电容器将为产品的设计和应用提供强有力的支持。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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