WMSIC Electronic Components

CL10B153KB8NNNC

ModelCL10B153KB8NNNC
Package0603
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL10B153KB8NNNC
Type
SAMSUNG
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL10B153KB8NNNC
Electronic Component
1
Electronic Component
15nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0000002596
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述: CL10B153KB8NNNC

一、产品简介

CL10B153KB8NNNC 是一款由三星(SAMSUNG)制造的多层陶瓷电容器(MLCC),具备表面贴装(SMD)特点,适用于各种通用电路和电子设备。这款贴片电容的额定电压为50V,电容值为15nF(即0.015µF),具有±10%的容差,能够在广泛的温度范围内稳定工作。

二、产品规格

  1. 安装类型: 表面贴装(SMD)
  2. 应用: 通用
  3. 额定电压: 50V
  4. 电容值: 15nF (0.015µF)
  5. 容差: ±10%
  6. 温度系数: X7R
  7. 工作温度范围: -55°C ~ 125°C
  8. 最大厚度: 0.035" (0.90mm)
  9. 尺寸: 0603 封装 (1.60mm x 0.80mm)

三、产品特点

  1. 高频特性: 作为一种MLCC,CL10B153KB8NNNC在高频信号条件下表现出很好的特性,非常适合用于高频和射频应用,是现代电子设备中不可或缺的基础元件。

  2. 良好的电压特性: 此电容器的额定电压为50V,能够满足大多数通用电路的需求,为电路提供更高的稳定性和安全性。

  3. 高温稳定性: 该电容器的工作温度范围广,从-55°C至125°C,这使其非常适合用于严苛环境下的应用。

  4. 紧凑设计: 尺寸为0603(1.60mm x 0.80mm),厚度仅为0.035"(0.90mm),使其适用于空间有限的电路设计。

  5. 负载寿命: 采用X7R的温度系数,能够在较宽的温度范围内维持电容的稳定性,减小因温度变化带来的电容值变化。

四、应用领域

CL10B153KB8NNNC广泛应用于各种电子产品中,包括但不限于:

  • 消费电子: 智能手机、平板电脑和笔记本电脑等。
  • 工业设备: 自动化设备、传感器和控制系统。
  • 汽车电子: 车载电子设备和控制模块。
  • 通信设备: 无线设备、基站和信号处理器。

五、总结

CL10B153KB8NNNC是一款高性能的多层陶瓷电容,因其卓越的电气特性、宽温工作范围及紧凑的封装设计,使其成为现代电子产品中不可或缺的基础元件。无论在高速信号处理还是电源滤波方面,CL10B153KB8NNNC均表现优异,是设计师和工程师在选择电容器时的极佳选择。对于追求高可靠性和高性能的电子项目,三星的这款贴片电容器将为产品的设计和应用提供强有力的支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.