Model & package intelligence
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CL10A226MPCNUBE
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10A226MPCNUBE
- Type
- SAMSUNG
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10A226MPCNUBE
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.028g
- Electronic Component
- 1
- Electronic Component
- BM0258721508
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL10A226MPCNUBE 产品概述
一、产品简介
CL10A226MPCNUBE 为三星（SAMSUNG）生产的多层陶瓷电容（MLCC），标称容值 22 µF，公差 ±20%，额定电压 10 V，介质类型 X5R，封装为 0603（1608 公制）。该型号属于高介电常数陶瓷电容器，适用于对体积与去耦性能有较高要求的消费电子与嵌入式电源电路。
二、主要规格参数
- 容值：22 µF
- 容差：±20%
- 额定电压：10 V
- 介质：X5R（温度范围及温度特性符合 X5R 类别）
- 封装：0603（1608 公制）表面贴装
三、产品特点与优势
- 小尺寸高容值：0603 封装兼具小占板面积与相对较高的电容容量，利于高密度 PCB 布局。
- 低阻抗特性：陶瓷电容固有的低 ESR/ESL，使其在高频去耦和旁路场景下表现优异。
- 稳定性与兼容性：X5R 介质在 -55°C 到 +85°C 范围内保持相对稳定的电容特性，适合大多数商用电子温度环境。
- 品质与一致性：作为知名厂商产品，具有一致性好的批次品质和良好的供应链支持。
四、性能注意事项
- 直流偏置效应：高介电常数陶瓷在施加直流电压时会出现容值下降，实际工作电压下的有效容值通常低于标称值。设计时应考虑偏置带来的容量损失，必要时并联更高电压等级或增加旁路电容。
- 温度依赖：X5R 对温度有一定容值变化，虽优于低端介质但并非温度无关，关键电路应在规格内验证。
- 机械应力敏感：陶瓷材料脆性较大，贴装与 PCB 设计需避免过度弯曲或应力集中以防开裂。
五、封装与焊接指南
- 推荐依据厂商给出的焊盘图与回流曲线进行 PCB 设计与焊接。0603 体积小，更需注意助焊剂与焊接参数以减少热应力。
- 避免在电容附近布置可能产生机械应力的过孔或紧固件，焊后检测开裂和虚焊。
六、典型应用场景
- 电源去耦与稳压输出旁路（如 DC-DC 模块输入/输出滤波）
- 移动设备与便携电子（要求小体积与高去耦性能）
- 电源管理与模拟前端的局部旁路
七、选型建议
在需要小封装与较大容量的场合，CL10A226MPCNUBE 是优选之一。但若电路在接近额定电压工作、或对容量随偏压变化敏感，应评估实际工作电压下的有效容值，必要时选择更高额定电压或采用并联不同容量/封装组合以保证性能和可靠性。
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