Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL21B475KLB6PNE
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL21B475KLB6PNE
- Type
- SAMSUNG
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL21B475KLB6PNE
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.048g
- Electronic Component
- 1
- Electronic Component
- BM0245741501
- Electronic Component
- X7R
- Voltage
- 35V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL21B475KLB6PNE 产品概述
一、产品简介
CL21B475KLB6PNE 为 SAMSUNG（三星）生产的车规级多层陶瓷电容，规格为 4.7 µF、±10% 初始容差、额定电压 35 V，介质材料为 X7R，封装 0805（公制 2012）。该器件针对汽车电子环境设计，兼顾高容量与小封装，适合对体积和可靠性有严格要求的车载电源与去耦场合。
二、主要参数
- 容值：4.7 µF
- 初始容差：±10%
- 额定电压：35 V
- 介质：X7R（温度特性约 -55°C 至 +125°C，容值变化范围通常在 -15% 至 +15%）
- 封装：0805（约 2.0 × 1.25 mm）
- 品牌：SAMSUNG（三星）
- 应用定位：车规级（满足车载长期可靠性验证要求）
三、可靠性与环境适应性
X7R 介质在广泛温度范围内提供相对稳定的电容值，适合汽车工作温区。作为车规件，通常需满足高温储存、热循环、湿热应力及振动冲击等可靠性测试（常见参考标准为 AEC‑Q200 测试项）。建议在设计时考虑偏压和温度引起的容值下降，并留有裕量。
四、封装与安装注意
0805 封装兼顾装配密度与焊接可靠性。推荐布局与安装要点：
- 保持电容端电极与 PCB 焊盘良好焊接，避免过长引线或弯折导致机械应力集中；
- 在可能的高振动或热循环环境中，增加周边固定或应力缓冲设计；
- 回流焊温度按通用无铅工艺控制（参考器件制造商的焊接曲线），避免多次高温循环。
五、典型应用场景
- 车载 ECU、传感器供电去耦与旁路；
- 汽车信息娱乐系统、ADAS 模块的滤波与稳定电源；
- DC‑DC 转换器输入/输出滤波，耦合与储能场合；
- 对体积有限但需较高电容量的消费类与工业应用亦适用。
六、选型与使用建议
- 设计留有容值与电压裕量：在车载高应力环境下建议按额定电压 60–80% 使用以延长寿命并减小偏压引起的容值损失；
- 关注温度系数：X7R 在高低温下容值会有变化，关键电路请做温度下的容值验证；
- 若需明确车规资质，请向供应商索取 AEC‑Q200 报告与可靠性试验记录、批次数据与包装信息。
以上概述旨在帮助工程师快速把握 CL21B475KLB6PNE 的关键特性与应用要点，便于在车载及严苛环境中进行合理选型与设计。若需更详细的电气模型（ESR/ESL、频率响应曲线）、封装尺寸图或可靠性报告，请联系供应商索取完整规格书与测试数据。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
