WMSIC Electronic Components

CL32B476KQVVPNE

ModelCL32B476KQVVPNE
Package1210
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL32B476KQVVPNE
Type
SAMSUNG
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL32B476KQVVPNE
Electronic Component
1
Electronic Component
47uF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.162g
Electronic Component
1
Electronic Component
BM0265916352
Electronic Component
X7R
Voltage
6.3V
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

三星CL32B476KQVVPNE 多层陶瓷贴片电容(MLCC)产品概述

一、产品核心参数概览

CL32B476KQVVPNE是三星电子推出的中容值多层陶瓷贴片电容(MLCC),核心参数精准匹配低电压、宽温环境的电路需求:

  • 标称容值:47μF(电容代码“476”对应47×10⁶pF);
  • 精度等级:±10%(满足大多数滤波、耦合电路的偏差要求);
  • 额定电压:6.3V DC(适配3.3V/5V等低电压供电系统);
  • 温度特性:X7R(工作温度范围-55℃~+125℃,容值变化率≤±15%,宽温稳定性优异);
  • 封装标识:1210(英制尺寸,对应公制3225规格)。

二、封装与物理规格

该型号采用1210标准贴片封装,物理尺寸符合IPC行业规范:

  • 长度:3.2±0.2mm;
  • 宽度:2.5±0.2mm;
  • 典型厚度:1.6mm(具体批次需参考三星官方datasheet)。
    封装设计紧凑,适配自动贴片机高效生产,可兼容大多数PCB板的布局需求,降低组装成本。

三、电气性能与可靠性

作为三星主流MLCC系列产品,CL32B476KQVVPNE具备以下核心优势:

  1. 低ESR设计:高频下等效串联电阻(ESR)低,适合电源滤波、射频耦合等对损耗敏感的场景;
  2. 宽温稳定性:X7R材质避免了Y5V等材质的“高温容量衰减”问题,-55℃~+125℃范围内容值波动极小;
  3. 电压可靠性:额定6.3V设计,若采用80%降额(实际工作电压≤5V),可显著延长产品寿命,降低失效风险;
  4. 环保合规:符合RoHS 2.0、REACH等国际标准,不含铅、镉等有害物质,适配绿色电子产品设计。

四、典型应用场景

该型号广泛应用于需要低电压、宽温稳定、中容值的电子设备,核心场景包括:

  • 消费电子:智能手机、平板电脑、蓝牙耳机的电源模块滤波(如电池供电回路去耦);
  • 通信设备:路由器、交换机、光模块的信号耦合与电源滤波;
  • 工业控制:小型PLC、传感器模块的辅助电源滤波(覆盖工业级温度要求);
  • 便携式设备:充电宝、智能手环的低功耗电路去耦。

五、品牌与质量保障

三星作为全球MLCC主要供应商,CL32B系列产品具备:

  • 产能稳定:成熟生产线可满足批量订单需求,减少供应链风险;
  • 一致性优异:批量产品参数偏差控制严格,降低电路调试难度;
  • 可靠性认证:部分批次通过AEC-Q200(汽车级)认证,若需汽车应用可确认具体批次;
  • 技术支持:提供完整datasheet与应用指导,帮助客户解决选型与焊接问题。

六、使用与选型注意事项

  1. 焊接工艺:回流焊峰值温度≤260℃,焊接时间≤10秒(避免高温损坏陶瓷层);
  2. 机械应力:MLCC易碎,焊接后避免过度弯折PCB,组装时控制夹具压力;
  3. 存储条件:存储于25℃±5℃、湿度≤60%环境,开封后建议1年内使用完毕;
  4. 降额使用:实际工作电压≤5V(额定电压80%),延长产品寿命;
  5. 批次确认:不同批次参数可能略有差异,批量采购前需核对最新datasheet。

该产品凭借三星的品牌优势与稳定性能,成为低电压电路滤波、耦合的高性价比选择,广泛适配消费电子、通信等领域的量产需求。

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