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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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CL10X226MQ8QRWC 是一款由三星(SAMSUNG)公司生产的贴片多层陶瓷电容(MLCC),属于其CL系列产品。该电容具有22μF的容值,采用X6S材质,额定电压为6.3V,精度为±20%,封装形式为0603。这款电容广泛应用于各种电子设备中,特别是在需要高电容值和稳定性能的电路中。
CL10X226MQ8QRWC 采用X6S材质,这种材质在温度稳定性方面表现出色。X6S材质的温度系数为±22%,工作温度范围为-55°C至+105°C。这意味着在广泛的温度范围内,电容的容值变化较小,能够保证电路的稳定性和可靠性。
该电容的标称容值为22μF,精度为±20%。这种精度水平适用于大多数通用电子设备,特别是在对电容值要求不是特别严格的电路中。±20%的精度意味着实际容值可能在17.6μF至26.4μF之间波动。
CL10X226MQ8QRWC 的额定电压为6.3V。这意味着在不超过6.3V的电压下,电容可以正常工作而不会发生击穿或损坏。选择电容时,额定电压是一个非常重要的参数,必须确保其高于电路中的最大工作电压。
该电容采用0603封装,尺寸为1.6mm x 0.8mm。0603封装是一种非常常见的贴片电容封装形式,适用于高密度PCB布局。其小巧的尺寸使得它能够在空间受限的电路板上使用,同时保持良好的电气性能。
CL10X226MQ8QRWC 广泛应用于各种电子设备中,包括但不限于:
三星(SAMSUNG)作为全球知名的电子元器件制造商,以其高质量和可靠性著称。CL10X226MQ8QRWC 作为三星CL系列产品的一部分,经过了严格的质量控制和测试,确保其在各种应用场景下的稳定性和耐用性。
在选择CL10X226MQ8QRWC 时,需要考虑以下因素:
CL10X226MQ8QRWC 是一款高性能的贴片多层陶瓷电容,具有22μF的容值、6.3V的额定电压和±20%的精度。其X6S材质提供了良好的温度稳定性,0603封装则适用于高密度PCB布局。作为三星CL系列产品的一部分,该电容在质量和可靠性方面表现出色,广泛应用于消费电子、通信设备、工业控制和汽车电子等领域。在选择和使用该电容时,需根据具体应用需求进行合理选型和布局,以确保电路的稳定性和可靠性。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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