WMSIC Electronic Components

CL21B105KAFNNNE

ModelCL21B105KAFNNNE
Package0805
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SAMSUNG CL21B105KAFNNNE
Type
SAMSUNG
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL21B105KAFNNNE
Electronic Component
1
Electronic Component
1uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.049g
Electronic Component
1
Electronic Component
BM69414111
Electronic Component
X7R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:SAMSUNG CL21B105KAFNNNE 贴片电容

一、产品基本信息

产品型号:CL21B105KAFNNNE
类型:多层陶瓷电容(MLCC)
电容量:1µF
额定电压:25V
容差:±10%
温度系数:X7R
工作温度范围:-55°C ~ 125°C
封装类型:0805(2012公制)
尺寸:2.00mm × 1.25mm × 1.35mm(长 × 宽 × 厚)
品牌:SAMSUNG(三星)

二、技术特点

CL21B105KAFNNNE是一款高性能的表面贴装多层陶瓷电容,具备多项优越的性能指标。其1µF的电容量,加上25V的额定电压,使其适合作为多种电路设计中的通用电容元件。

  1. 电容量与额定电压:1µF的电容量对于大部分电源去耦、信号滤波等应用场景而言非常适合,25V的额定电压确保其可以在相对较高的电压环境下安全工作,满足现代电子设备对电源稳定性的高要求。

  2. 温度系数与工作温度范围:采用X7R温度系数,表明其电容值在-55°C至125°C的广泛温度范围内变化较小,能保证在极端环境条件下的良好性能,对高温和低温极限条件有着较强的抵抗力,适用于汽车、工业设备等严苛环境中的应用。

  3. 容差:±10%的容差标准提供了适度的灵活性,能够解决多种设计需求,并确保在批量生产时的良好一致性。

  4. 优良的电气特性:CL21B105KAFNNNE的低ESR(等效串联电阻)和适中的ESL(等效串联电感)使其在高频信号处理和稳定电压输出方面表现出色,特别适合高频开关电源中的去耦和滤波使用。

三、应用场景

CL21B105KAFNNNE电容器广泛应用于各种电子设备和电路中,包括但不限于:

  • 电源去耦:在电源系统中,作为输入和输出端的去耦电容,减少电源噪声,提高电源稳定性。
  • 信号滤波:用于信号处理电路,以滤除高频噪声,确保信号的清晰度。
  • 外部连接:在PCB电路中,用于互联不同模块,确保信号完整性。
  • 高温或严苛环境应用:非常适合用于汽车电子、工业自动化设备、消费电子等行业。这些行业往往对元器件的耐温和稳定性有着高要求,而CL21B105KAFNNNE正好满足这些需求。

四、封装与可焊性

0805封装类型具有小尺寸、轻重量的特点,使得其在现代紧凑型电子设备中极为适用。同时,该封装类型确保了良好的可焊性,便于自动化生产线的贴装,提高了生产效率。

五、总结

总之,SAMSUNG CL21B105KAFNNNE是一款性价比极高的MLCC贴片电容,凭借其优良的电性能、宽广的工作温度范围以及广泛的应用适应性,成为电子工程师在设计和开发过程中优先选择的元件。其可靠性和耐久性使其广泛应用于各种高性能电子产品中,是实现现代电路稳定性的重要组成部分。无论是在通信设备、计算机、汽车电子,还是其他高科技产业中,CL21B105KAFNNNE都能够发挥出色的性能,助力电子产品的整体提高。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.