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CL10A226MP8NRNC MLCC CL10A226MP8NRNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10A226MP8NRNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10A226MP8NRNC
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.04g
- Electronic Component
- 1
- Electronic Component
- BM0259740238
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL10A226MP8NRNC 产品概述
一、产品简介
CL10A226MP8NRNC 为三星（SAMSUNG）生产的高容值多层贴片陶瓷电容器（MLCC），额定电容 22 µF，额定电压 10 V，容差 ±20%，介质类型 X5R，封装为 0603（1608 公制）。该型号以小体积获得较高容值，适合空间受限且需中等稳定性的去耦、旁路与储能应用。
二、主要参数
- 容值：22 µF
- 额定电压：10 V DC
- 容差：±20%（M）
- 介质：X5R（温度范围与容量变动特性见厂商说明）
- 封装：0603（1608 公制，约 1.6 mm × 0.8 mm）
- 品牌：SAMSUNG（三星）
三、性能特点
- 高容值：在 0603 小封装下实现 22 µF，可显著节省 PCB 面积。
- 中等温度稳定性：X5R 介质在 -55°C 至 +85°C 具较稳定的电容特性，适用于多数消费类与工业类电源系统。
- 低等效串联电阻（ESR）和良好频率响应，适合去耦与滤波。
- 注意 DC 偏压效应：高介电常数材料在施加直流偏压时会出现容量下降，建议在目标工作电压条件下进行评估。
四、典型应用
- 微处理器、射频模块和电源管理芯片的本地去耦与旁路
- 移动设备、可穿戴、物联网终端的电源储能与滤波
- DC/DC 转换器输入/输出侧的降噪与稳定化
- 空间受限的消费电子与工业控制产品
五、设计与选型建议
- 在实际电源电压下测量有效电容以判断是否满足系统需求，必要时选用更高额定电压或并联多个电容。
- 对于要求极低 ESR 或高纹波电流的场合，可考虑并联不同规格（如陶瓷与固态电容）以互补特性。
- 留意温度与频率对容量的影响，X5R 在极端温度下仍会出现一定漂移，应纳入容差预算。
六、封装与焊接注意事项
- 0603 封装尺寸小，易受机械应力影响，推荐按照厂商建议的焊盘尺寸与回流焊曲线进行贴装。
- 避免在电容两端产生过大的 PCB 弯曲或应力集中，存储与贴装过程中注意防潮措施与回流温度限制（详见数据手册）。
七、可靠性与质量保证
- 三星 MLCC 具备行业级生产与品质控制，建议参照产品数据手册查看温度循环、耐电压与寿命试验等详细项目。
- 关键应用应要求供应链提供批次报告或进行进料检验，验证 DC 偏压下的容量保持率与耐久性。
八、替代与采购建议
- 选型时可比较其他知名厂商同参数产品，关注实际的 DC bias 曲线、ESR、寿命与成本。
- 采购时确认包装形式（卷盘/托盘）、最小起订量与交期，必要时索取样品进行电性验证。
如需我帮忙整理该型号的典型 DC bias 曲线、等效串联电阻或推荐 PCB 焊盘尺寸，可提供更详细的设计参考。
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