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CL05C220JB5NNNC MLCC CL05C220JB5NNNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL05C220JB5NNNC
- Type
- SAMSUNG
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL05C220JB5NNNC
- Electronic Component
- 1
- Electronic Component
- 22pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0259721570
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL05C220JB5NNNC 产品概述
一、概述
CL05C220JB5NNNC 为三星（SAMSUNG）生产的贴片多层陶瓷电容（MLCC），规格为 0402（公制 1005），标称电容 22 pF，精度 ±5%，额定电压 50 V，温度系数为 C0G（亦称 NP0）。该产品以其电容量稳定、损耗低、寄生参数小及小型化封装，广泛用于高频、精密时钟与滤波电路。
二、主要参数
- 电容值：22 pF
- 容差：±5%（J）
- 额定电压：50 V
- 温度系数：C0G（温度稳定、近似 0 ppm/°C）
- 封装：0402（1005 公制，约 1.0 mm × 0.5 mm）
- 品牌：SAMSUNG
三、关键特性
- 温度稳定性高：C0G/NP0 材料电容值随温度变化极小，适合对温漂敏感的电路。
- 低损耗、高 Q 值：适用于射频与高频滤波、匹配与谐振电路。
- 封装微小：0402 节省 PCB 面积，适合高密度布局。
- 优良的可靠性：工业级制造工艺，适配自动化贴装与回流焊工艺。
四、典型应用
- 高频/射频滤波与匹配网络（射频前端、天线匹配）
- 振荡器与时钟电路（晶振负载电容）
- 高频旁路与耦合电路
- 精密模拟电路（ADC、低噪放大器输入端）
- 移动设备、无线模块与射频板卡等体积受限场合
五、封装与 PCB 布局建议
- 推荐按照制造商数据表的焊盘尺寸与焊膏开孔设计；0402 尺寸建议焊盘覆盖率约 60–75%。
- 布线尽量短且直，减小寄生电感；对射频电路建议靠近参考地和采用地平面屏蔽。
- 避免在元件下方或附近出现过大板弯曲应力，贴装与波峰/回流焊后应避免强机械弯曲，降低裂纹风险。
- 建议使用无铅回流工艺并遵循元器件的回流曲线与回流次数限制。
六、可靠性与储存
- MLCC 对湿度与温度循环敏感，长期运输与存储应采用防潮包装（干燥卷带）。必要时按厂商建议进行预烘。
- 装配过程中要控制焊接温度与机械应力，防止因焊接或板弯曲引起的微裂纹导致失效。
七、选型与采购建议
- 型号 CL05C220JB5NNNC 为三星标准件，订购时请核对包装形式（卷带 reels）、端子表面处理与 RoHS 合规信息。
- 如需更高电压、不同温漂或更大电容值，可在三星或其他品牌同类 C0G 系列中比对替代型号；采购前以厂家数据表为准，确认温度范围、额定电压与封装图纸。
如需我帮您核对电气模型（ESR、ESL、寄生自谐频率）、建议 PCB 焊盘尺寸或给出针对某一应用（例如晶振负载或射频匹配）的布局示意，请告知具体应用场景。
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