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CL31A226KPHNNNE MLCC CL31A226KPHNNNE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- SAMSUNG CL31A226KPHNNNE
- Type
- SAMSUNG
- Unit
- Electronic Component
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL31A226KPHNNNE
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.074g
- Electronic Component
- 1
- Electronic Component
- BM69413643
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL31A226KPHNNNE（三星贴片电容）
一、产品基本信息
CL31A226KPHNNNE是一款高性能的多层陶瓷电容（MLCC），其电容值为22µF，容差为±10%。该电容的额定电压为10V，温度系数采用了X5R材料，这使得它在不同温度和电压条件下具有优良的稳定性。产品的工作温度范围涵盖了极低温度－55°C到较高温度85°C，广泛适用于多种电路环境。
二、产品规格
- 电容值：22µF
- 容差：±10%
- 额定电压：10V
- 温度系数：X5R
- 工作温度范围：-55°C ~ 85°C
- 安装类型：表面贴装（SMD/SMT）
- 封装规格：1206（3216公制）
- 尺寸：长3.20mm x 宽1.60mm x 高1.80mm
三、设计特点
该型号贴片电容采用三星先进的陶瓷材料技术，实现了高容量与小体积的理想结合。1206封装形式使得其在现代电子产品中能够轻松集成，适应狭小的电路板空间。其厚度仅为1.80mm，进一步增强了其在空间紧凑的应用场景中的适用性。
X5R材料的使用保证了电容在温度变化和电压波动下的性能稳定，使其在高频、高速电路应用中表现出色。电容容差为±10%，在实际应用中提供了较高的设计灵活性，从而满足不同电路对电容值的要求。
四、应用场景
CL31A226KPHNNNE电容广泛应用于各类电子设备，例如：
- 消费电子产品：如智能手机、平板电脑、笔记本电脑等
- 计算机及其周边：主板、显卡等电子组件
- 工业设备：传感器、自动化控制系统等
- 汽车电子：如车载音响、导航系统等
- 通信设备：路由器、基站等基础设施
由于其优异的高频性能和温度稳定性，该电容在滤波、旁路和耦合等电路中表现效果尤为显著。它是实现高效能电子设计不可或缺的元器件之一。
五、总结
三星的CL31A226KPHNNNE贴片电容，以其22µF的电容量、优异的工作温度范围和适应性、以及小巧的封装尺寸，成为电子设计中理想的选择。它能够满足当今电子设备对高性能、高可靠性和空间利用率的多重要求。无论是在日常消费电子产品，还是在工业应用中，CL31A226KPHNNNE都以其卓越的表现赢得了广泛的应用。对于设计工程师来说，选择这款电容将有助于提升产品的整体性能和稳定性，是确保成功设计的可靠组件。
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