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CL03A104KA3NNNC MLCC CL03A104KA3NNNC
Configuration
1 options
Configuration
Option 163565
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL03A104KA3NNNC
- Type
- SAMSUNG
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL03A104KA3NNNC
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.09g
- Electronic Component
- 1
- Electronic Component
- BM0266109411
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL03A104KA3NNNC 产品概述
一、产品简介
CL03A104KA3NNNC 为 SAMSUNG（三星）品牌的贴片多层陶瓷电容（MLCC），标称容量 100 nF，容差 ±10%，额定电压 25 V，介质材料分类为 X5R，封装为 0201。该产品面向高密度 SMT 装配场景，适合对体积、频率响应与温度范围有一定要求的消费电子与工业应用。
二、主要参数
- 容值：100 nF（0.1 µF）
- 精度：±10%（K）
- 额定电压：25 V
- 温度系数 / 介质：X5R（对温度与偏压有适中变化）
- 封装：0201（超小型表面贴装）
三、特性与优势
- 体积极小，利于高密度 PCB 布局与小型化产品设计。
- X5R 介质在 -55℃ 至 +85℃ 范围内具有较好的电容量保持能力，适合一般温度工况。
- 25 V 额定电压为常见模拟、数字电源去耦与旁路场景提供合理裕度。
- 三星品质控制与生产批次管理，适合量产与长期供应需求。
四、典型应用场景
- 智能手机、可穿戴设备等便携设备的电源去耦与旁路。
- 模拟前端、ADC/DAC 参考电容与去耦。
- 通信、摄像模组和 IoT 终端的滤波与退耦设计。
- 小型化电源模块和 DC-DC 转换器输入/输出滤波。
五、设计与使用建议
- 考虑 X5R 的温度与直流偏压特性：在接近额定电压或高温下电容量会下降，建议在电路设计时留有裕量（例如选用更大容值或更高额定压的器件以保证容性需求）。
- 装配时遵循供应商推荐回流焊曲线，避免超出温度峰值与延长暴露时间。
- 0201 封装对贴装精度与锡膏印刷要求高，需优化贴装程序并控制回流焊工艺。
- 使用时避免对 PCB 施加过大弯曲或机械应力，以防止裂纹和失效。
六、可靠性与质量控制
- 推荐在元件入库与贴装前进行外观与批号核对，采用适当的储存条件（干燥、常温、避免潮湿）以防潮湿吸收影响回流焊质量。
- 常见失效模式包括热应力或机械应力导致的裂纹、以及长期偏压加速的电容衰减；在关键应用可考虑进行额外的加速寿命评估。
七、替代与选型注意
- 若需更稳定的电容随温度变化，考虑 C0G/NP0 系列；若要求更高工作电压或更小的偏压影响，可选更高额定电压或不同介质。
- 在选型时同时比对尺寸、温度特性、DC Bias 曲线与制造商可靠性数据以确保满足系统要求。
如需器件的封装尺寸图、回流焊曲线、DC Bias 曲线或可靠性测试报告，可进一步提供以便做更精确的设计验证与选型支持。
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