Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL10C331JB8NNNC是三星(SAMSUNG)公司生产的一款高性能表面贴装多层陶瓷电容(MLCC)。该电容器具有较高的电容密度和较广的应用范围,尤其适合高频和射频电路。其额定电压为50V,电容值为330pF,并采用C0G(NP0)温度特性,适合各种精密应用。
CL10C331JB8NNNC电容器因其优越的性能特征,广泛应用于多个领域,包括:
电容器最大的优势在于其优越的电气特性。CL10C331JB8NNNC的C0G(NP0)温度系数确保其电容在工作温度范围内保持稳定。相较于其他电容类型,C0G电容在高频应用中的损耗更低,响应更快,适应性更强。这使得该款电容器在需要低失真和高线性度的应用场景中表现优异。
该电容器符合0603封装标准,尺寸为1.60mm x 0.80mm,符合现代电子设备向高密度集成发展的趋势。此外,最大厚度仅为0.90mm,使其能够轻松适配各种印刷电路板(PCB)设计。其表面贴装设计使得其在组装过程中与其他元器件的兼容性较好,便于在自动化生产中实现高速贴装。
CL10C331JB8NNNC具有广泛的工作温度范围,从-55°C到125°C,适合各种极端环境条件。这种温度适应性使得该电容器能在极端气候下保持高可靠性,对于要求高稳定性和长期工作的应用尤为重要。
综合来看,CL10C331JB8NNNC是一款性能优越、兼容性强的陶瓷多层电容器。它在确保高频应用中信号的清晰度与稳定性方面表现出色,同时适用于众多行业及应用场景。不论是在消费电子、工业自动化、汽车电子,还是在医疗及通信设备中,CL10C331JB8NNNC都能为设计师提供理想的解决方案。选择三星的这款电容器,客户不仅能够享受到卓越的产品品质,还能提升电子产品的整体性能及可靠性。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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