Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL10X106MO8NRNC MLCC CL10X106MO8NRNC
Configuration
1 options
Configuration
26+
Availability on request
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10X106MO8NRNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10X106MO8NRNC
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0227572866
- Electronic Component
- X6S
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL10X106MO8NRNC (SAMSUNG 贴片电容)
一、产品基本信息
CL10X106MO8NRNC 是一款由三星（SAMSUNG）生产的表面贴装多层陶瓷电容器（MLCC），其额定电压为16V，电容值为10µF，具有±20%的容差，适合各种通用应用。该电容采用0603（1608公制）封装尺寸，具体的长宽为1.60mm x 0.80mm，厚度最大为0.035"（0.90mm）。工作温度范围为-55°C到105°C，符合需要高温及低温等级的应用。
二、主要技术参数
电容值与容差：该电容器的电容值为10µF，允许的容差为±20%，这意味着在工作过程中，电容值的变动范围可以从8µF到12µF之间波动，这样的容差使得电容器适合多种电路设计需求，尤其是在对电容值精准要求不太严格的通用电路中。
工作电压：电压额定为16V，适合在低至中等电压条件下工作，这使得其能够应用于许多耐受电压不太高的场景，如便携式电子设备、家用电器及各种小型电路板。
温度特性与稳定性：选择 X6S 作为温度系数，该材料在广泛的温度范围内保持电容值的相对稳定性。与其他类型的电容相比，X6S 温度系数的变化较小，确保电容在温度的变动中可靠性高，适合于气候条件多变的环境应用。
尺寸与封装：0603 封装是业界标准的表面贴装组件尺寸，能够帮助设计师在PCB设计中节省空间。这种小型化的设计对于现代电子产品的小型化至关重要，尤其在便携式设备中能够降低整体体积和重量。
三、应用场景
消费电子：如智能手机、平板电脑和笔记本电脑等对空间和重量有严格要求的设备中， CL10X106MO8NRNC 可用作滤波、耦合及去耦合等功能的电容器，改善电源的稳定性和信号完整性。
汽车电子：在汽车电子系统中，如动力管理、导航系统和信息娱乐系统，可以利用此电容来提高电路的性能和可靠性，确保各类电子组件在恶劣环境中正常运行。
工业设备：该电容器同样适合用于工业自动化设备中，来平衡和稳定电源，以及在信号链中提高信号传输稳定性。
医疗设备：在对电气性能和安全可靠性要求极高的医疗电子产品中，该电容可以作为重要的电气组件，确保设备精确稳定运作。
四、优势与保护
该电容器的多层陶瓷结构及对环境的优越耐受性，能够在各种条件下提供持久稳定的性能。同时，作为表面贴装器件，其焊接方式方便快速，并能够适配现代化的自动化生产线，提升整体生产效率。
五、结语
综上所述，CL10X106MO8NRNC 是一款功能多样、应用广泛且可靠的电子元器件，尤其适合在空间有限和要求稳定性的电子电路中。其高品质与稳定性使得该产品在电子领域中备受青睐，是设计师和工程师进行电路设计时的重要选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
