WMSIC Electronic Components

ST MMFTN3019E MOSFET MMFTN3019E

ModelMMFTN3019E
PackageSOT-523-3
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST MMFTN3019E
Type
ST
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST
Electronic Component
MMFTN3019E
Electronic Component
1
Package
SOT-523-3
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0226493311
Power Dissipation(Pd)
150mW
Electronic Component
Electronic Component
Electronic Component
4000
Voltage(Vdss)
30V
Capacitor(Ciss)
13pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMFTN3019E 产品概述

一、产品概览

MMFTN3019E 是一款小信号 N 沟道场效应晶体管,来自 ST(先科)系列,采用超小封装 SOT-523-3。器件为低电流、低电容、30V 耐压的开关型 MOSFET,适用于对体积、寄生电容和栅极驱动要求较高的小功率电子电路中担当开关、隔离或电平转换角色。

二、主要电气参数

  • 类型:N 沟道 MOSFET
  • 漏源电压 Vdss:30 V
  • 阈值电压 Vgs(th):1.5 V(典型)
  • 导通电阻 RDS(on):8 Ω @ Vgs=4 V,Id=10 mA
  • 连续漏极电流 Id:100 mA
  • 功耗 Pd:150 mW
  • 输入电容 Ciss:13 pF;输出电容 Coss:9 pF;反向传输电容 Crss:4 pF
  • 封装:SOT-523-3(超小封装,适合高密度贴装)

三、器件特性解析

该器件阈值约 1.5 V,接近逻辑电平,可在低电压逻辑驱动下部分开启,但给出的 RDS(on) 在 Vgs=4 V、Id=10 mA 条件下为 8 Ω,表明在较大电流工作时损耗显著,主要面向小信号开关而非功率传输。低 Ciss/Coss/Crss 值有利于快速开关和减小栅极驱动能量,适合高速信号切换或射频路径切换场合。

四、典型应用领域

  • 移动设备或便携仪器中的信号开关、隔离或复用电路
  • 小电流控制或电平转换(例如微控制器 I/O 控制)
  • 接口保护与断开(如在低功耗模式下切断次级电路)
  • 高频或快速脉冲信号路径切换,需注意功率与热限制

五、封装与热管理

SOT-523-3 为超小型封装,面积有限,热阻较高。器件额定耗散功率仅 150 mW,实际应用中应避免长时间接近额定功耗。建议在 PCB 设计上优化散热走线、减小相邻热源,并保证工作电流远低于 100 mA 的平均值以避免温升影响可靠性。

六、选型建议与注意事项

  • 若应用为信号级开关或低电流控制,MMFTN3019E 为合适选择;若需要传输更大电流或更低导通损耗,应选用 RDS(on) 更低、Pd 更高的功率 MOSFET。
  • 注意 RDS(on) 测试条件(Vgs=4 V、Id=10 mA),在实际更高 Id 下 RDS(on) 可能恶化,需按实际工况计算损耗并留有裕度。
  • 在高速切换场合,利用其低 Ciss/Coss 优势可减小开关能耗,但仍需考虑栅极驱动阻抗与布局以避免振荡或过冲。
  • 小封装对焊接、维修和高温环境敏感,建议在可靠性评估中进行温升仿真和实际测试。

总体来看,MMFTN3019E 以其小体积、低电容与逻辑兼容阈值,适合各类小信号开关与低功耗控制应用,但不适合高电流或高功率场景。

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