WMSIC Electronic Components

ST MMBT3904E transistor MMBT3904E

ModelMMBT3904E
PackageSOT-523
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST MMBT3904E
Type
ST
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST
Electronic Component
MMBT3904E
Electronic Component
1
Package
SOT-523
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.017g
Electronic Component
1
Electronic Component
BM0227127170
Transistor Type
NPN
Frequency(f T)
300MHz
Power Dissipation(Pd)
150mW
Electronic Component
Electronic Component
Electronic Component
4000
Collector Current(Ic)
200mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBT3904E 产品概述

MMBT3904E 是一款通用小信号 NPN 晶体管,适用于放大和开关应用。器件由 ST(先科) 生产,采用超小型 SOT-523 封装,针对移动设备和高密度电路板的空间受限场合进行了优化。器件具有较高的直流电流放大倍数与较快的特征频率,兼顾低漏电与低饱和压降,适合电平转换、前置放大及高速开关用途。

一、主要参数

  • 晶体管类型:NPN(小信号)
  • 最大集电极电流 Ic:200 mA
  • 集-射极击穿电压 Vceo:40 V
  • 功耗(耗散功率)Pd:150 mW
  • 直流电流增益 hFE:300(典型值,测试条件 10 mA、Vce=1 V)
  • 特征频率 fT:300 MHz(表征高频放大能力)
  • 集电极截止电流 Icbo:50 nA(典型低漏电)
  • 集-射极饱和电压 VCE(sat):300 mV(典型,测试条件 50 mA 与 5 mA)
  • 射-基极击穿电压 Vebo:6 V
  • 描述类别:未分类(通用小信号晶体管)
  • 品牌:ST(先科)
  • 封装:SOT-523(超小型三引脚封装)

二、特性说明

  • 高增益:hFE≈300 在 10 mA 工作点下提供良好的电流放大能力,便于在低偏置电流下实现较大增益。
  • 宽频带:fT≈300 MHz,适合对中高频信号进行放大或作为高速开关元件。
  • 低漏电:Icbo 仅约 50 nA,有利于低功耗与高阻态下的小漏电要求。
  • 低饱和压降:VCE(sat) 约 300 mV(在 50 mA、5 mA 条件下),使在饱和开关时损耗较低。
  • 功耗与热限:封装功耗 Pd 为 150 mW,意味着在较大电流或较高电压工况下需注意热设计与散热限制。

三、典型应用

  • 低电流放大器:音频前置放大、传感器信号放大等。
  • 开关驱动:驱动小型继电器、光耦或作为逻辑电平转换的开关元件。
  • 高频信号处理:宽带放大、射频前端的低功耗放大与缓冲(受功率限制与匹配影响)。
  • 便携式与高密度电路:SOT-523 超小封装使其适合手机、可穿戴设备与微型模块。

四、封装与热管理

MMBT3904E 采用 SOT-523 超小型封装,适合高密度贴片布板,但封装限制了散热能力。Pd=150 mW 的热耗散上限要求在设计时:

  • 控制持续电流与功耗(尽量在安全工作区内操作)。
  • 在 PCB 布局中使用较大的铜箔或热通孔以帮助散热。
  • 若需长时间大电流工作,考虑采用更大封装或并联器件方案。

五、选型建议与注意事项

  • 在需要更高功耗或更大集电电流的场合,优先选用功耗更高或封装更大的同型号或替代型号。
  • 高频应用需关注输入/输出匹配与封装寄生参数,SOT-523 在 GHz 级别可能受限。
  • 引脚排列因封装与厂商略有差异,最终设计前请参考 ST(先科) 官方数据手册与封装图纸以确认引脚定义与焊盘尺寸。
  • 对温度敏感的电路应考虑温漂与击穿裕量,Vebo=6 V 意味基极—发射极反向耐压有限。

总结:MMBT3904E 是一颗面向空间受限、注重高增益与中高频性能的通用 NPN 小信号晶体管,适用于便携与高密度电路的放大与开关任务,但设计时需特别注意其功耗与热管理限制。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.