WMSIC Electronic Components

ST MMBTA42 transistor MMBTA42

ModelMMBTA42
PackageSOT-23
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST MMBTA42
Type
ST
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST
Electronic Component
MMBTA42
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.028g
Electronic Component
1
Electronic Component
BM0232256310
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
50MHz
Power Dissipation(Pd)
350mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBTA42 产品概述

一 特性概述

MMBTA42 是一款高压 NPN 小信号三极管,封装为 SOT-23,适合需要高耐压与小体积的表面贴装电路。该器件拥有 300V 的集—射极击穿电压 (Vceo) 与最高 500mA 的集电极电流能力,结合 350mW 的耗散功率,适用于高压开关、启动电路与小功率放大场合。品牌信息:ST(先科)提供该型号的常见版本。

二 主要参数说明

  • 晶体管类型:NPN(单颗,数量:1)
  • 最大集电极电流 Ic:500mA
  • 集—射极击穿电压 Vceo:300V(高耐压,适合高压侧使用)
  • 耗散功率 Pd:350mW(SOT-23 封装的功耗受限,需注意散热与功率管理)
  • 直流电流增益 hFE:≈80(在 Ic=10mA、Vce=10V 条件下)
  • 特征频率 fT:50MHz(适合中低频放大与开关)
  • 集电极截止电流 Icbo:100nA(漏电流小,有利于高阻态性能)
  • 集电极饱和电压 VCE(sat):约 500mV(在 IC=20mA、IB=2mA 条件下)
  • 工作结温度范围:-55℃ ~ +150℃(Tj)
  • 射基极击穿电压 Vebo:6V

三 典型应用

  • 高压信号开关与脉冲驱动(例如小型电源启动电路或高压脉冲源)
  • 初级侧低功率放大器与电平移位(中低频段,受 fT 限制)
  • 保护电路与过压检测(利用高 Vceo 与低 Icbo 的组合)
  • 便携或受限空间的表面贴装电子产品,需高耐压但低功耗场景

四 设计与使用建议

  • 散热与功耗:SOT-23 的 Pd 为 350mW,实际电路中应考虑散热路径与环境温度,必要时通过 PCB 大铜箔或热通孔进行散热。长期高电流工作需对耗散做严谨估算与降额。
  • 饱和驱动:若用作开关,保证基极驱动足够以达到所需饱和度;参考 VCE(sat)=0.5V@20mA/2mA,设计基极限流与驱动源电阻。
  • 高压注意事项:Vceo=300V 表示器件可承受较高的反向电压,但在高压边缘需控制爬电距离与 PCB 绝缘。
  • 噪声与频率:fT=50MHz,适合音频至射频前段的某些应用,但不适合高频射频功率放大。
  • 基极限制:Vebo=6V,基极-发射极间反向电压承受有限,避免在设计中施加过高反向偏压。

五 包装与选购建议

该型号常见封装为 SOT-23,便于自动贴装与小型化设计。选购时建议对照厂方数据手册核对管脚定义、最大额定值与温度降额曲线;若需更高功率或不同增益特性,可参考同系列或功率更大的封装替代品。最后,针对高压和高温环境下的可靠性,请优先选择来自正规渠道并查看批次质量报告。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.