Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ST 1N4760APF Zener diode 1N4760APF
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST 1N4760APF
- Type
- DO-41
- Minimum package
- 250 袋
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST
- Electronic Component
- 1N4760APF
- Electronic Component
- 1
- Package
- DO-41
- Electronic Component
- Zener Diode
- Electronic Component
- 0.222g
- Electronic Component
- 1
- (Zzk)
- 2kΩ
- (Zzt)
- 150Ω
- Electronic Component
- BM0227754543
- Diode
- 1
- Current(Ir)
- [email protected]
- Power Dissipation(Pd)
- 1W
- Electronic Component
- 64.6V~71.4V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1N4760APF 68V 稳压二极管 产品概述
一、产品简介
1N4760APF 是 ST（先科）出品的高压稳压二极管，标称稳压值 68V，额定耗散功率 1W，常用于中等电压的基准、稳压与过压钳位场合。器件为 DO-41 轴向直插封装，适合通过孔安装和手工或波峰焊接工艺生产。
二、主要电气参数
- 标称稳压值（Vz）：68V（典型）
- 稳压范围：64.6V ～ 71.4V（制造允许范围）
- 反向电流 Ir：5 μA @ 51.7V（低电流漏泄性能）
- 耗散功率 Pd：1W（在规定环境温度下的最大耗散）
- 动态阻抗 Zzt：150 Ω（在测试电流下的稳压阻抗）
- 脉冲或拐点阻抗 Zzk：2 kΩ（显示低电流区的阻抗特性）
三、典型应用场景
- 作为稳压基准或低功率本地稳压器（用串联限流电阻与之配合）
- 过压保护与电压钳位（抑制尖峰与反向缘故）
- 仪表与测量电路的参考源、偏置网络等
四、封装与安装要点
DO-41 轴向封装适合穿孔安装，注意引线弯折位置与焊接温度。为保证长期可靠性，应避免在超过额定耗散下长时间使用，必要时采取散热或降低工作电流的措施。
五、使用注意事项与热管理
1W 为器件在规定温度下的极限耗散值，实际应用需计算稳态消耗 P = Vz × Iz 并留有余量；在较高环境温度下应进行功率降额。使用时通常在输入与稳压二极管间串联限流电阻，限流电阻计算公式：R = (Vin - Vz) / Iz（选择 Iz 使 P 不超过 Pd）。同时注意反向电流及动态阻抗会影响低电流时的稳压精度。
六、选型与替代建议
同系列的高压 1N47xx 系列或其他厂家的等效 68V、1W 稳压二极管可作为替代，选型时注意比较稳压范围、反向电流和动态阻抗等关键参数以满足电路精度与温漂要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
