WMSIC Electronic Components

SHOU HAN TS665WS tactile switch TS665WS

ModelTS665WS
PackageSMD
BrandSHOU HAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHOU HAN TS665WS
Type
SMD
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHOU HAN
Electronic Component
TS665WS
Electronic Component
1
Package
SMD
Electronic Component
Electronic Component
Electronic Component
Switch
Electronic Component
0.403g
Electronic Component
2N
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0265023978
Electronic Component
Electronic Component
Electronic Component
10
Operating Temperature
25℃~+70℃
Switch
6mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TS665WS 轻触开关产品概述

TS665WS是首韩(SHOU HAN)品牌针对小型电子设备信号触发需求优化的微型立贴轻触开关,具备体积紧凑、操作手感适中、可靠性强等特点,广泛适配消费电子、智能穿戴、车载小部件等领域。以下从核心定位、参数性能、结构设计等维度展开详细概述:

一、产品核心定位与典型应用场景

TS665WS定位于信号级轻触开关,聚焦小型设备的功能切换需求,避免大电流负载应用。其典型应用场景包括:

  1. 智能穿戴设备:如智能手环的模式切换、蓝牙耳机盒的重置按键;
  2. 小型消费电子:迷你遥控器(电视盒子、智能家居控制器)、便携式蓝牙音箱的暂停/播放键;
  3. 车载内饰部件:车载USB充电器开关、小型车载控制面板的功能键;
  4. 工业控制小型面板:传感器模块调试按键、微型PLC辅助控制键。

这些场景的共同特点是:需小体积开关、信号级电流(<50mA)、频繁操作但无大电流负载,TS665WS的参数完全匹配此类需求。

二、关键参数与性能解析

TS665WS的核心参数经过针对性优化,平衡了体积、手感与可靠性:

  • 电路结构:单刀单掷(SPST),仅实现“通-断”切换,结构简单无多余触点干扰;
  • 按钮与手感:圆形按钮设计,按压点集中、操作一致性强;作用力2N(介于1.5N~3N中间值),既避免误触(如设备碰撞),又无需过大力度即可触发;
  • 尺寸规格:6mm×6mm×5mm(长×宽×高),微型设计仅占用6×6mm PCB footprint,显著节省紧凑空间;
  • 电气性能:触点电流50mA、额定电压12V,稳定传输低功耗信号(如MCU IO口触发),禁止驱动继电器、电机等大电流负载;
  • 寿命与环境:工作寿命10万次(老化测试验证),满足多数设备23年日常使用;温度范围-25℃+70℃,覆盖冬季低温、夏季室内高温及常规车载环境(短时间高温除外)。

三、结构设计特点

TS665WS围绕“小型化、易安装、高可靠”设计:

  1. 不带支架设计:取消额外支架,压缩体积、降低成本,适合无额外支撑的紧凑布局(高应力场景可选带支架型号);
  2. J型引脚立贴:J型引脚适配立贴(SMD)工艺,贴装后引脚与焊盘接触稳定,不易因振动脱落,且支持SMT自动化生产;
  3. 黑色按钮与无灯设计:黑色按钮耐脏、视觉低调;无灯设计降低功耗(无LED)、简化结构,适合无需指示灯的功能键;
  4. 触点材料:采用银合金触点,确保接触电阻稳定,减少氧化概率,提升信号传输可靠性。

四、安装与兼容性说明

TS665WS安装需注意以下要点:

  • 贴装工艺:立贴SMD封装,推荐回流焊温度峰值≤260℃(符合常规SMD标准);手工焊接需控制烙铁温度≤350℃,避免损坏内部结构;
  • PCB焊盘适配:需匹配J型引脚间距与尺寸(参考首韩官方 datasheet),避免焊盘过大虚焊或过小贴装困难;
  • 空间预留:高度5mm,需预留≥1mm PCB上方安全间隙,避免与其他元器件干涉。

五、选型与使用注意事项

为避免使用不当,需关注:

  1. 电流限制:严格遵守50mA触点电流,禁止驱动大电流负载(否则触点烧蚀);
  2. 环境适配:高温(>70℃)或防水场景需选耐温/防水款;
  3. 定制需求:默认仅黑色按钮,其他颜色需联系首韩定制;
  4. 振动场景:车载等振动环境建议选带支架型号,提升稳定性。

六、总结

TS665WS作为首韩微型立贴轻触开关,以小体积、适中手感、高可靠性为核心优势,精准匹配小型电子设备信号触发需求。参数平衡成本与性能,适合消费电子、智能穿戴等领域量产应用。如需进一步了解贴装参数或定制,可参考首韩官方资料或联系供应商。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.