WMSIC Electronic Components

SHOU HAN 10.0 QHHTZB6.3 Connector 10.0

Model10.0-QHHTZB6.3
PackageSMD
BrandSHOU HAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 164146

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHOU HAN 10.0 QHHTZB6.3
Type
SMD
Minimum package
100 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SHOU HAN
Electronic Component
10.0 QHHTZB6.3
Electronic Component
1
Package
SMD
Electronic Component
USB Connector
Electronic Component
1.1g
(L)
10mm
Electronic Component
1
Electronic Component
USB 2.0
Electronic Component
BM0266077138
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Electronic Component
5
Electronic Component
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

首韩SHOU HAN USB 2.0 Type-A母卧贴SMD连接器产品概述

一、产品核心定位与设计目标

该连接器是针对小型化消费电子及轻量工业设备的USB2.0标准接口方案,采用卧贴SMD封装适配自动化贴装产线,兼顾电源传输(1.5A)与数据通信(USB2.0) 双重功能,解决传统直插式接口占用空间大、贴装效率低的问题,为紧凑PCB布局提供高效接口解决方案。

二、关键技术参数解析

产品核心参数围绕接口标准、电气性能、机械特性、环境适应性四大维度设计,具体如下:

  1. 协议与接口标准:符合USB 2.0规范,支持最高480Mbps高速数据传输,Type-A母座设计兼容绝大多数USB Type-A公头(如标准数据线、充电器插头);
  2. 电气性能:额定电源电流1.5A(满足多数小功率设备充电需求,如蓝牙耳机、迷你移动电源),额定电压30V(低于USB标准5V,安全冗余设计);
  3. 机械特性:4P触点(对应USB2.0数据/电源引脚)、单端口设计;卧贴SMD封装,体长仅10mm(小型化优势明显,适配紧凑PCB布局);插拔寿命5000次(满足常规产品3-5年生命周期的插拔需求);
  4. 环境适应性:工作温度范围-25℃~+85℃,覆盖室内常温、车载低温(冬季户外)及小型电器内部高温环境;胶芯采用黑色耐老化材料,避免光老化导致的胶壳脆化。

三、典型应用场景适配

基于参数特性,该连接器适配以下场景:

  1. 便携式消费电子:蓝牙耳机充电盒、智能手环充电器、迷你移动电源(卧贴封装节省内部空间,1.5A电流满足快速充电);
  2. 小型家电与智能家居:智能插座、加湿器控制器、小型夜灯(自动化贴装适配批量生产,5k次寿命满足日常插拔);
  3. 工业辅助设备:小型传感器节点、便携测试仪器(温度范围覆盖工业现场常规环境,SMD封装抗振动性能优于直插);
  4. 电子配件:USB扩展器、数据线转接器(兼容标准公头,小型化设计便于集成到配件外壳内)。

四、可靠性与品质保障

  1. 插拔寿命验证:经第三方测试,插拔5000次后触点仍保持稳定接触力,无明显磨损或变形;
  2. 环境可靠性:通过温度循环测试(-25℃~+85℃,循环50次)、振动测试(10-2000Hz,加速度1g),确保复杂环境下性能稳定;
  3. 环保与安全:符合RoHS 2.0标准(无铅、无镉等有害物质),电气参数冗余设计(电流/电压低于额定值使用更安全)。

五、安装与使用注意事项

  1. 贴装工艺要求:采用回流焊工艺,需匹配厂家温度曲线(峰值温度230-250℃,时间≤30s),避免高温导致胶芯变形或触点氧化;
  2. PCB设计注意:预留足够焊盘空间(参考datasheet尺寸),避免焊盘过小导致虚焊;
  3. 使用维护:插拔时避免侧向力(防止触点偏移),定期清理接口灰尘(避免接触不良)。

六、品牌与市场定位

首韩SHOU HAN作为专注电子连接器10余年的厂商,该产品针对中低端消费电子及轻量工业市场,以高性价比、稳定性能为核心竞争力,已批量应用于国内多家消费电子厂商产品中,获得客户一致认可。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.