WMSIC Electronic Components

SXN SMDRI127-150MT Inductor SMDRI127

ModelSMDRI127-150MT
PackageSMD
BrandSXN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SXN SMDRI127-150MT
Type
SMD
Minimum package
500

Technical parameters

Electronic Component
SXN
Electronic Component
SMDRI127-150MT
Electronic Component
1
Package
SMD
Type
Magnetic Display Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
4.768g
Inductor
15uH
Electronic Component
1
Electronic Component
BM0264968621
Current
4.5A
Resistor(DCR)
27mΩ
Electronic Component
500
and Current(Isat)
8A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMDRI127-150MT 磁胶屏蔽功率电感产品概述

一、产品核心定位与类别

SMDRI127-150MT是顺翔诺(SXN)品牌推出的磁胶屏蔽表面贴装(SMD)功率电感,聚焦中大功率电源电路的“高效储能、抗干扰、小型化”需求,覆盖消费电子、工业设备、通信等多领域。其磁胶屏蔽结构可降低电磁辐射,紧凑封装适配高密度PCB布局,是电源设计中替代裸装电感的优选方案。

二、关键参数与性能指标

该电感的核心参数围绕“电流承载、损耗控制、精度稳定性”三大维度设计,具体如下:

  • 电感特性:标称值15μH,精度±20%,满足常规滤波、储能需求;
  • 电流能力:额定电流(持续工作)4.5A,饱和电流(峰值)8A——额定电流下长期稳定,峰值电流应对瞬间负载波动;
  • 损耗控制:直流电阻(DCR)仅27mΩ,显著降低铜损;
  • 物理规格:SMD封装尺寸12.3×12.3mm(长宽),厚度约6mm,适配标准贴片工艺。

三、核心优势解析

1. 低损耗设计提升电源效率

27mΩ的低DCR是核心亮点:4.5A额定电流下,损耗仅约0.55W(P=I²·R),比同规格普通电感(DCR≥35mΩ)损耗降低28%,减少电源模块发热,延长设备寿命。

2. 高电流承载覆盖多场景

额定4.5A持续电流适配笔记本电源、工业DC-DC模块;8A饱和电流可应对启动瞬间、负载突变(如车载快充启动),避免电感饱和导致的输出波动。

3. 磁胶屏蔽降低电磁干扰

相比裸装电感,磁胶屏蔽可将EMI辐射降低30%以上,减少对射频模块、传感器等敏感电路的干扰,简化EMC设计流程,降低认证难度。

4. 紧凑封装适配小型化趋势

12.3×12.3mm封装比同电流裸装电感节省20%PCB空间,适合平板电脑、智能穿戴充电电路等便携式设备,及高密度电源模块布局。

5. 宽温性能适应恶劣环境

磁胶材料耐温范围-40℃~125℃,可在工业低温、车载高温等场景稳定工作,满足多领域可靠性要求。

四、典型应用场景

SMDRI127-150MT的参数特性适配以下主流应用:

  • 消费电子:笔记本电源、平板电脑充电电路、智能电视电源模块;
  • 工业设备:PLC电源、12V→5V/3.3V DC-DC转换器、伺服驱动器辅助电源;
  • 通信设备:基站电源模块、路由器/交换机电源、光模块供电电路;
  • 车载电子:车载快充(QC3.0/PD)、车载信息娱乐系统辅助电源。

五、应用与焊接注意事项

为确保性能稳定,需注意以下要点:

  1. 电流控制:实际工作电流≤4.5A,峰值≤8A,避免过流老化;
  2. 焊接工艺:采用回流焊,峰值温度230℃~250℃(时间≤10s),避免手工焊接过温损坏磁胶;
  3. PCB布局:靠近电源输出端减少线路损耗,磁胶面朝上最大化抗干扰;
  4. 散热设计:高负载场景(≥4A)可在PCB背面加散热铜箔,辅助散热。

该电感凭借“低损耗、高电流、抗干扰、小型化”的综合优势,成为中功率电源设计的实用选择,可有效提升设备性能与可靠性。

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