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SHIKUES MSK4005D Diode MSK4005D
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SHIKUES MSK4005D
- Type
- SHIKUES
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SHIKUES
- Electronic Component
- MSK4005D
- Electronic Component
- 1
- Package
- DFN1006-2L
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.01g
- Electronic Component
- 1
- Electronic Component
- BM0264580608
- Current
- 500mA
- Diode
- 1
- Current(Ir)
- 50uA
- (Vf)
- 520mV
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MSK4005D 产品概述
一、产品简介
MSK4005D 为时科（SHIKUES）出品的一款独立式肖特基二极管，采用 DFN1006-2L（市场标识 SOD-882）微小封装。器件以低正向压降、快速开关特性和耐受中等反向电压为主要优势，适合空间受限和对效率有较高要求的便携及开关电源等应用场景。
二、主要电气参数
- 类型：肖特基二极管（独立式）
- 典型正向压降（Vf）：约 0.52 V（随正向电流变化）
- 直流反向耐压（Vr）：40 V
- 最大整流电流（If）：500 mA（连续）
- 最大反向电流（Ir）：50 μA（在额定反向电压与温度条件下）
- 工作结温范围：-55 ℃ ～ +125 ℃
注：正向压降与反向漏电随工作电流和结温变化明显，实际选型时请参考器件曲线与应用工况。
三、封装与机械特性
MSK4005D 采用 DFN1006-2L / SOD-882 小尺寸封装，具有占板面积小、寄生电感与寄生电阻低的优点。适合高密度 PCB 布局与高频开关场合。封装兼容常规回流焊工艺，焊接和热管理效果受焊盘设计与 PCB 铜箔面积影响，建议根据散热需求适当扩展焊盘铜箔以降低结温。
四、典型应用
- 移动电源、便携设备的反向连接保护与整流
- DC-DC 降压/升压转换器中的续流或整流元件
- 电池管理与充电器电路中的低损耗整流
- 开关电源、汽车电子（非高压主回路）和一般电源保护电路
五、热与可靠性考虑
MSK4005D 支持工业级温度范围（-55 ℃ ～ +125 ℃），但在高温条件下反向漏电和正向压降会升高，需在热设计上给予足够余量。器件的最大允许通过电流及功耗受结温限制，建议在 PCB 布局中使用合适的热扩散层和过孔以提高散热性能，避免长期在高结温工况下运行以延长可靠性。
六、使用与注意事项
- 在高反向电压或高温环境下，反向漏电流会增大，涉及低电流检测或高阻抗电路时需评估影响。
- 若需更高整流电流，可采用并联方式，但并联时应注意电流均分和热耦合问题。
- 焊接时遵循推荐回流曲线，避免超温和长时间高温暴露；储存与处理遵守防潮和防静电规范。
- 选型时建议配合实际工作电流、开关频率和最大结温等条件，参考完整的数据手册以获取温度、电流依赖的特性曲线与最大限值。
MSK4005D 以其低压降、小尺寸和良好的开关特性，为需要在有限空间内提升能效和降低功耗的电源系统提供了实用的方案。若需更详细的电气特性曲线、封装尺寸与回流焊建议，请索取厂家完整规格书。
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